Inventor · disambiguated record

Sinichi Sakamoto

Also filed as: SAKAMOTO SINICHI

1 granted patent·20 citations·filing 1994–1994

40Inventor score

Technology areasH10P

Files withMITSUBISHI ELECTRIC CORP1

Top patents by PatentIndex Score

1 record

0145US5457072AProcess for dicing a semiconductor wafer having a plated heat sink using a temporary substrateMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Oct 10, 1995·20 cites·6 claims

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