Inventor

SOBIESKI DANIEL

US2 patents

⚠️ This page may combine multiple inventors who share the name “SOBIESKI DANIEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

1 patent

US10692847B2Jun 23, 2020

Inorganic interposer for multi-chip packaging

INTEL CORP7 citations80

COVENTOR INC

1 patent

US10885253B2Jan 5, 2021

System and method for determining dimensional range of repairable defects by deposition and etching in a virtual fabrication environment

COVENTOR INC0 citations44