Inventor

LEIBOVITZ JACQUES

US19 patents

⚠️ This page may combine multiple inventors who share the name “LEIBOVITZ JACQUES”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEIBOVITZ JACQUES

HEWLETT PACKARD CO

Stacked solid via formation in integrated circuit systems

Stacked solid via formation in integrated circuit systems

Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps

Low cost, high thermal performance package for flip chips with low mechanical stress on chip

Heat pipe-electrical interconnect integration method for chip modules

Hierarchical tape automated bonding method

Heat pipe-electrical interconnect integration for chip modules

Solder retention ring for improved solder bump formation

Controlled etching process for forming fine-geometry circuit lines on a substrate

Reworkable die attachment

Process using supercritical conditions for producing highly accurate and homogeneous powder mixture useful in fabrication of high quality ceramic superconductors

Methods for forming high density multi-chip carriers

Tape automated bonding system which facilitate repair

(unassigned)

Reliable low thermal resistance package for high power flip clip ICs

Surface mounting pin grid arrays

Multi-layer fabrication in integrated circuit systems

Reworkable die attachment to heat spreader

AGILENT TECHNOLOGIES INC

Method and structure for uniform height solder bumps on a semiconductor wafer

Method and structure for uniform height solder bumps on a semiconductor wafer