Inventor

CHEN KIM H

US7 patents

⚠️ This page may combine multiple inventors who share the name “CHEN KIM H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEWLETT PACKARD CO

4 patents

US5199165AApr 6, 1993

Heat pipe-electrical interconnect integration method for chip modules

HEWLETT PACKARD CO98 citations96

US5155661AOct 13, 1992

Aluminum nitride multi-chip module

HEWLETT PACKARD CO73 citations95

US5426405AJun 20, 1995

Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects

HEWLETT PACKARD CO73 citations93

US5161090ANov 3, 1992

Heat pipe-electrical interconnect integration for chip modules

HEWLETT PACKARD CO53 citations92

AGILENT TECHNOLOGIES INC

2 patents

US6191478B1Feb 20, 2001

Demountable heat spreader and high reliability flip chip package assembly

AGILENT TECHNOLOGIES INC77 citations94

US6698646B2Mar 2, 2004

Room temperature gold wire bonding

AGILENT TECHNOLOGIES INC16 citations74

(unassigned)

1 patent

US5585671ADec 17, 1996

Reliable low thermal resistance package for high power flip clip ICs

116 citations96