Inventor

SUPPELSA ANTHONY B

US39 patents

Patents

39 patents

US5438216AAug 1, 1995

Method of making high density solder bumps and a substrate socket for high density solder bumps

MOTOROLA INC221 citations97

US4940181AJul 10, 1990

Pad grid array for receiving a solder bumped chip carrier

MOTOROLA INC193 citations97

US4894663AJan 16, 1990

Ultra thin radio housing with integral antenna

MOTOROLA INC305 citations97

US5542171AAug 6, 1996

Method of selectively releasing plastic molding material from a surface

MOTOROLA INC56 citations96

US5536917AJul 16, 1996

Housing with integral thin film resistive snap-fits

MOTOROLA INC43 citations96

US5280139AJan 18, 1994

Selectively releasing conductive runner and substrate assembly

MOTOROLA INC101 citations96

US5166774ANov 24, 1992

Selectively releasing conductive runner and substrate assembly having non-planar areas

MOTOROLA INC84 citations96

US4939792AJul 3, 1990

Moldable/foldable radio housing

MOTOROLA INC120 citations95

US5573859ANov 12, 1996

Auto-regulating solder composition

MOTOROLA INC45 citations93

US5771004AJun 23, 1998

Gas detection system for a portable communication

MOTOROLA INC40 citations92

US5455446AOct 3, 1995

Leaded semiconductor package having temperature controlled lead length

MOTOROLA INC24 citations92

US5232758AAug 3, 1993

Non-hardening solvent removable hydrophobic conformal coatings

MOTOROLA INC44 citations92

US5177669AJan 5, 1993

Molded ring integrated circuit package

MOTOROLA INC57 citations92

US5177134AJan 5, 1993

Tacking agent

MOTOROLA INC47 citations92

US5172852ADec 22, 1992

Soldering method

MOTOROLA INC36 citations92

US5065122ANov 12, 1991

Transmission line using fluroplastic as a dielectric

MOTOROLA INC41 citations92

US5686226ANov 11, 1997

Method of forming an applicator for applying tacking media to a circuit substrate

MOTOROLA INC21 citations91

US5001038AMar 19, 1991

Process for photoimaging a three dimensional printed circuit substrate

MOTOROLA INC23 citations91

US5300808AApr 5, 1994

EPROM package and method of optically erasing

MOTOROLA INC32 citations89

US5167361ADec 1, 1992

Method and apparatus for two sided solder cladded surface mounted printed circuit boards

MOTOROLA INC30 citations88

US5773198AJun 30, 1998

Method of forming high resolution circuitry by depositing a polyvinyl alcohol layer beneath a photosensitive polymer layer

MOTOROLA INC18 citations84

US5591364AJan 7, 1997

Housing with integral opening feature

MOTOROLA INC17 citations82

US4990724AFeb 5, 1991

Method and apparatus for electrically interconnecting opposite sides of a flex circuit

MOTOROLA INC21 citations80

US4338506AJul 6, 1982

Method of trimming thick film capacitor

MOTOROLA INC23 citations80

US5338391AAug 16, 1994

Method of making a substrate having selectively releasing conductive runners

MOTOROLA INC8 citations74

US5116433AMay 26, 1992

Solder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing same

MOTOROLA INC14 citations74

US5740066AApr 14, 1998

Electrical circuit board and circuit board assembly

MOTOROLA INC14 citations73

US5373276ADec 13, 1994

Self centering coil

MOTOROLA INC8 citations73

US5176773AJan 5, 1993

Method of manufacturing a ceramic carrier

MOTOROLA INC2 citations63

US5075820ADec 24, 1991

Circuit components having different characteristics with constant size

MOTOROLA INC5 citations63

US5028399AJul 2, 1991

Gas manifold for solder reflow processing atmosphere

MOTOROLA INC5 citations63

US4992139AFeb 12, 1991

Conductive mask and method of making same

MOTOROLA INC3 citations63

SUPPELSA ANTHONY B

Patents

Light erasable multichip module

Thermally conductive integrated circuit package with radio frequency shielding

Method of forming a three-dimensional printed circuit assembly

Method of manufacturing a circuit carrying substrate having coaxial via holes

Encapsulated electronic component having a heat diffusing layer

Method for solder application and reflow

Method of making a transfer molded semiconductor device

Method of making high density solder bumps and a substrate socket for high density solder bumps

Pad grid array for receiving a solder bumped chip carrier

Ultra thin radio housing with integral antenna

Method of selectively releasing plastic molding material from a surface

Housing with integral thin film resistive snap-fits

Selectively releasing conductive runner and substrate assembly

Selectively releasing conductive runner and substrate assembly having non-planar areas

Moldable/foldable radio housing

Auto-regulating solder composition

Gas detection system for a portable communication

Leaded semiconductor package having temperature controlled lead length

Non-hardening solvent removable hydrophobic conformal coatings

Molded ring integrated circuit package

Tacking agent

Soldering method

Transmission line using fluroplastic as a dielectric

Method of forming an applicator for applying tacking media to a circuit substrate

Process for photoimaging a three dimensional printed circuit substrate

EPROM package and method of optically erasing

Method and apparatus for two sided solder cladded surface mounted printed circuit boards

Method of forming high resolution circuitry by depositing a polyvinyl alcohol layer beneath a photosensitive polymer layer

Housing with integral opening feature

Method and apparatus for electrically interconnecting opposite sides of a flex circuit

Method of trimming thick film capacitor

Method of making a substrate having selectively releasing conductive runners

Solder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing same

Electrical circuit board and circuit board assembly

Self centering coil

Method of manufacturing a ceramic carrier

Circuit components having different characteristics with constant size

Gas manifold for solder reflow processing atmosphere

Conductive mask and method of making same