Inventor
WONG CHEE WAI
SG4 patents
⚠️ This page may combine multiple inventors who share the name “WONG CHEE WAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
3 patentsUS7714427B2May 11, 2010
Integrated circuit die configuration for packaging
INTEL CORP9 citations79
US7341887B2Mar 11, 2008
Integrated circuit die configuration for packaging
INTEL CORP10 citations79
US7242084B2Jul 10, 2007
Apparatuses and associated methods for improved solder joint reliability
INTEL CORP6 citations59