Inventor
CHEN HSIAO LU
TW5 patents
Patents
5 patentsUS12593733B2Mar 31, 2026
Vertical light emitting diode die packaging method
INGENTEC CORP0 citations48
US12418011B2Sep 16, 2025
Bonding and transferring method for die package structures
INGENTEC CORP0 citations48
US12417964B2Sep 16, 2025
Via-filling method of through-glass via substrate
INGENTEC CORP0 citations48
US12489093B2Dec 2, 2025
Magnetic LED die transferring device and magnetic LED die transferring method
INGENTEC CORP0 citations45
US12150242B2Nov 19, 2024
LED circuit board structure and LED testing and packaging method
INGENTEC CORP0 citations44