Inventor
ENDO AKIHIKO
JP40 patents
⚠️ This page may combine multiple inventors who share the name “ENDO AKIHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMCO CORP
28 patentsUS7354844B2Apr 8, 2008
Method for manufacturing SOI substrate
SUMCO CORP43 citations95
US7718509B2May 18, 2010
Method for producing bonded wafer
SUMCO CORP26 citations92
US7713842B2May 11, 2010
Method for producing bonded wafer
SUMCO CORP31 citations92
US7767549B2Aug 3, 2010
Method of manufacturing bonded wafer
SUMCO CORP8 citations83
US7763541B2Jul 27, 2010
Process for regenerating layer transferred wafer
SUMCO CORP19 citations83
US7625808B2Dec 1, 2009
Method for manufacturing bonded wafer
SUMCO CORP9 citations83
US7442623B2Oct 28, 2008
Method for manufacturing bonded substrate and bonded substrate manufactured by the method
SUMCO CORP17 citations83
US7364984B2Apr 29, 2008
Method for manufacturing SOI substrate
SUMCO CORP12 citations83
US7867877B2Jan 11, 2011
Method for manufacturing SOI wafer
SUMCO CORP12 citations82
US7736998B2Jun 15, 2010
Silicon-on insulator substrate and method for manufacturing the same
SUMCO CORP11 citations79
US7446016B2Nov 4, 2008
Method for producing bonded wafer
SUMCO CORP8 citations74
US7851337B2Dec 14, 2010
Method for producing semiconductor substrate
SUMCO CORP5 citations73
US7416960B2Aug 26, 2008
Method for manufacturing SOI substrate
SUMCO CORP7 citations73
US8048767B2Nov 1, 2011
Bonded wafer and method for producing bonded wafer
SUMCO CORP2 citations63
US7855132B2Dec 21, 2010
Method of manufacturing bonded wafer
SUMCO CORP2 citations63
US7713838B2May 11, 2010
SOI wafer and its manufacturing method
SUMCO CORP4 citations63
US7544583B2Jun 9, 2009
SOI wafer and its manufacturing method
SUMCO CORP3 citations63
US7494899B2Feb 24, 2009
Method for manufacturing semiconductor substrate
SUMCO CORP4 citations63
US7951692B2May 31, 2011
Method of producing semiconductor substrate having an SOI structure
SUMCO CORP3 citations62
US7858494B2Dec 28, 2010
Laminated substrate manufacturing method and laminated substrate manufactured by the method
SUMCO CORP6 citations62
US7795117B2Sep 14, 2010
Method of producing semiconductor substrate having an SOI structure
SUMCO CORP2 citations62
US7960225B1Jun 14, 2011
Method of controlling film thinning of semiconductor wafer for solid-state image sensing device
SUMCO CORP4 citations61
US7902043B2Mar 8, 2011
Method of producing bonded wafer
SUMCO CORP0 citations52
US7790573B2Sep 7, 2010
Process for producing SOI substrate and process for regeneration of layer transferred wafer in the production
SUMCO CORP1 citations52
US8003494B2Aug 23, 2011
Method for producing a bonded wafer
SUMCO CORP1 citations51
US7927972B2Apr 19, 2011
Method for producing bonded wafer
SUMCO CORP1 citations51
US8048769B2Nov 1, 2011
Method for producing bonded wafer
SUMCO CORP0 citations41
US7927957B2Apr 19, 2011
Method for producing bonded silicon wafer
SUMCO CORP0 citations41