Inventor
NAKATA YOSHIHIRO
JP73 patents
⚠️ This page may combine multiple inventors who share the name “NAKATA YOSHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
26 patentsUS6613834B2Sep 2, 2003
Low dielectric constant film material, film and semiconductor device using such material
FUJITSU LTD51 citations96
US5602060AFeb 11, 1997
Process for the production of semiconductor devices
FUJITSU LTD479 citations96
US5770260AJun 23, 1998
Process for forming silicon dioxide film
FUJITSU LTD63 citations95
US6958525B2Oct 25, 2005
Low dielectric constant film material, film and semiconductor device using such material
FUJITSU LTD17 citations92
US6780498B2Aug 24, 2004
Silicon-based composition, low dielectric constant film, semiconductor device, and method for producing low dielectric constant film
FUJITSU LTD31 citations92
US5949130ASep 7, 1999
Semiconductor integrated circuit device employing interlayer insulating film with low dielectric constant
FUJITSU LTD20 citations92
US5763540AJun 9, 1998
Epoxy resin composition for encapsulating semiconductor
FUJITSU LTD19 citations92
US5659004AAug 19, 1997
Epoxy resin composition
FUJITSU LTD31 citations92
US7659357B2Feb 9, 2010
Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same
FUJITSU LTD10 citations84
US7262142B2Aug 28, 2007
Semiconductor device fabrication method
FUJITSU LTD14 citations84
US6727515B2Apr 27, 2004
Insulation film forming material, insulation film, method for forming the insulation film, and semiconductor device
FUJITSU LTD15 citations84
US7728065B2Jun 1, 2010
Material for forming exposure light-blocking film, multilayer interconnection structure and manufacturing method thereof, and semiconductor device
FUJITSU LTD5 citations74
US7476970B2Jan 13, 2009
Composition for forming insulating film and method for fabricating semiconductor device
FUJITSU LTD7 citations74
US7232769B2Jun 19, 2007
Method of forming amorphous silica-based coating film with low dielectric constant and thus obtained silica-based coating film
FUJITSU LTD7 citations74
US5976703ANov 2, 1999
Material and method for planarization of substrate
FUJITSU LTD14 citations68
US7830012B2Nov 9, 2010
Material for forming exposure light-blocking film, multilayer interconnection structure and manufacturing method thereof, and semiconductor device
FUJITSU LTD2 citations63
US7655576B2Feb 2, 2010
Insulator film, manufacturing method of multilayer wiring device and multilayer wiring device
FUJITSU LTD2 citations63
US7358299B2Apr 15, 2008
Silicon-based composition, low dielectric constant film, semiconductor device, and method for producing low dielectric constant film
FUJITSU LTD4 citations63
US7235866B2Jun 26, 2007
Low dielectric constant film material, film and semiconductor device using such material
FUJITSU LTD2 citations63
US12193151B2Jan 7, 2025
High-frequency circuit board and antenna module
FUJITSU LTD0 citations60
US12148724B2Nov 19, 2024
Package with built-in electronic components and electronic device
FUJITSU LTD0 citations60
US12185502B2Dec 31, 2024
Semiconductor apparatus and electronic apparatus
FUJITSU LTD0 citations52
US9496222B2Nov 15, 2016
Semiconductor device including insulating films with different moisture resistances and fabrication method thereof
FUJITSU LTD0 citations52
US9354517B2May 31, 2016
Resist composition and method for forming pattern
FUJITSU LTD0 citations52
US8378489B2Feb 19, 2013
Semiconductor device and manufacturing method therefor
FUJITSU LTD0 citations52
US7985700B2Jul 26, 2011
Composition for forming insulating film and method for fabricating semiconductor device
FUJITSU LTD0 citations52
SUNSTAR ENGINEERING INC
8 patentsUS6657035B1Dec 2, 2003
Moisture-curable one-pack-type urethane adhesive composition
SUNSTAR ENGINEERING INC53 citations95
US5304623AApr 19, 1994
One-pack type heat precurable moisture-curing sealant composition comprising isocyanate containing component and siloxane containing polyol
SUNSTAR ENGINEERING INC31 citations93
US5459185AOct 17, 1995
One-part moisture-curing orethane adhesive
SUNSTAR ENGINEERING INC26 citations92
US5034453AJul 23, 1991
Moisture-curing hot-melt sealant
SUNSTAR ENGINEERING INC23 citations92
US6348123B1Feb 19, 2002
Method for adhering polyolefin materials
SUNSTAR ENGINEERING INC15 citations83
US4983655AJan 8, 1991
Blocked polyisocyanurate compound and plastisol composition containing same
SUNSTAR ENGINEERING INC9 citations73
US4804710AFeb 14, 1989
Epoxy resin composition
SUNSTAR ENGINEERING INC14 citations73
US5204391AApr 20, 1993
Blocked polyisocyanurate and polyvinyl chloride plastisol composition containing the same
SUNSTAR ENGINEERING INC5 citations61
ADVANCED TELECOMMUNICATIONS RES INSTITUTE INTERNATIONAL
4 patentsUS11225984B2Jan 18, 2022
Actuator device, humanoid robot and power assist device
ADVANCED TELECOMMUNICATIONS RES INSTITUTE INTERNATIONAL3 citations73
US11794336B2Oct 24, 2023
Externally-driven joint structure
ADVANCED TELECOMMUNICATIONS RES INSTITUTE INTERNATIONAL0 citations62
US11635096B2Apr 25, 2023
Actuator device, humanoid robot and power assist device
ADVANCED TELECOMMUNICATIONS RES INSTITUTE INTERNATIONAL0 citations62
US11325244B2May 10, 2022
Externally-driven joint structure
ADVANCED TELECOMMUNICATIONS RES INSTITUTE INTERNATIONAL0 citations62
IMADA TADAHIRO
2 patentsKOBAYASHI YASUSHI
2 patentsUS8716209B2May 6, 2014
Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device
KOBAYASHI YASUSHI2 citations61
US8431464B2Apr 30, 2013
Process for producing silicic coating, silicic coating and semiconductor device
KOBAYASHI YASUSHI2 citations61
DENSO CORP
1 patentOZAKI SHIROU
1 patentHIURA RYOTA
1 patentTOKYO ELECTRON LTD
1 patentNAKASHIMA AKIRA
1 patentKISHII SADAHIRO
1 patentUNIV OSAKA
1 patentSTANLEY ELECTRIC CO LTD
1 patentShowing the top 50 of 73 patents by PatentIndex Score.