Inventor · disambiguated record

Say Yeow Lee

Also filed as: LEE SAY YEOW

1 granted patent·15 citations·filing 2006–2006

37Inventor score

Technology areasH10W

Files withCARSEM M SDN BHD1

Top patents by PatentIndex Score

1 record

0179US7846774B2Multiple row exposed leads for MLP high density packagesCARSEM M SDN BHD·Filed 2006·Granted Dec 7, 2010·15 cites·19 claims

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