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Inventor
MIYAKE MICHAEL K
US
2 patents
Patents
2 patents
US5701233A
Dec 23, 1997
Stackable modules and multimodular assemblies
IRVINE SENSORS CORP
259 citations
96
US5424920A
Jun 13, 1995
Non-conductive end layer for integrated stack of IC chips
IRVINE SENSORS CORP
147 citations
92