Inventor

TONG HO-MING

TW60 patents

⚠️ This page may combine multiple inventors who share the name “TONG HO-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TONG HO-MING

ADVANCED SEMICONDUCTOR ENG

Semiconductor chip package and method for making the same

Bump and fabricating process thereof

Solder ball fabricating process

Under-ball-metallurgy layer

Solder paste for fabricating bump

Solder ball fabricating process

Bump fabrication process

Semiconductor package and method for processing and bonding a wire

Process for fabricating wafer bumps

Bump manufacturing method

Lead-free bump fabrication process

Semiconductor wafer and testing method for the same

Bump manufacturing method

Solder ball attaching process

Solder ball fabrication process

Bump fabrication method

Under-bump-metallurgy layer for improving adhesion

Flip chip package process

Two-stage die-bonding method for simultaneous die-bonding of multiple dies

Wafer-level package structure

Bump fabrication process

Structure for preventing burnt fuse pad from further electrical connection

Method of forming bump

Method for preventing burnt fuse pad from further electrical connection

Bump fabrication process

Bump manufacturing method

Flip chip package substrate

Method of modifying tin to lead ratio in tin-lead bump

Bumping process

IBM

Electroplated solder terminal

In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing

Flip-Chip interconnections using lead-free solders

Electroplated solder terminal

Method of fabricating a reworkable module

Plated probe structure

Method of resiliently mounting an integrated circuit chip to enable conformal heat dissipation

Electronic substrate multiple location conductor attachment technology

Electronic device and heat sink assembly

Apparatus for temperature control of electronic devices

Method of applying flex tape protective coating onto a flex product

Flex tape protective coating

Hermetic package for an electronic device and method of manufacturing same

Hermetic package for an electronic device and method of manufacturing same

Electronic substrate multiple location conductor attachment technology

Method for bonding dielectric mounted conductors to semiconductor chip contact pads

Coated means for connecting a chip and a card

Hermetic package for an electronic device

ND HI TECH LAB INC

Diamond enhanced advanced ICs and advanced IC packages

Probe card system, method of manufacturing probe card system, method of using probe card system

ASE SHANGHAI INC

Packaging substrate and manufacturing method thereof