Inventor
LEE CHUN-CHI
TW45 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHUN-CHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
37 patentsUS6291271B1Sep 18, 2001
Method of making semiconductor chip package
ADVANCED SEMICONDUCTOR ENG220 citations99
US6420244B2Jul 16, 2002
Method of making wafer level chip scale package
ADVANCED SEMICONDUCTOR ENG93 citations98
US6191360B1Feb 20, 2001
Thermally enhanced BGA package
ADVANCED SEMICONDUCTOR ENG109 citations97
US6561411B2May 13, 2003
Wire bonding process and wire bond structure
ADVANCED SEMICONDUCTOR ENG47 citations96
US7285434B2Oct 23, 2007
Semiconductor package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG29 citations93
US6271057B1Aug 7, 2001
Method of making semiconductor chip package
ADVANCED SEMICONDUCTOR ENG33 citations93
US6864168B2Mar 8, 2005
Bump and fabricating process thereof
ADVANCED SEMICONDUCTOR ENG25 citations92
US6861346B2Mar 1, 2005
Solder ball fabricating process
ADVANCED SEMICONDUCTOR ENG21 citations92
US6819002B2Nov 16, 2004
Under-ball-metallurgy layer
ADVANCED SEMICONDUCTOR ENG28 citations92
US6692581B2Feb 17, 2004
Solder paste for fabricating bump
ADVANCED SEMICONDUCTOR ENG18 citations92
US6673711B2Jan 6, 2004
Solder ball fabricating process
ADVANCED SEMICONDUCTOR ENG19 citations92
US6664128B2Dec 16, 2003
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG25 citations92
US6201299B1Mar 13, 2001
Substrate structure of BGA semiconductor package
ADVANCED SEMICONDUCTOR ENG47 citations92
US6163076ADec 19, 2000
Stacked structure of semiconductor package
ADVANCED SEMICONDUCTOR ENG35 citations88
US6946729B2Sep 20, 2005
Wafer level package structure with a heat slug
ADVANCED SEMICONDUCTOR ENG15 citations84
US6846719B2Jan 25, 2005
Process for fabricating wafer bumps
ADVANCED SEMICONDUCTOR ENG16 citations84
US6827252B2Dec 7, 2004
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG18 citations84
US6617237B1Sep 9, 2003
Lead-free bump fabrication process
ADVANCED SEMICONDUCTOR ENG19 citations84
US6989326B2Jan 24, 2006
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG10 citations74
US6732912B2May 11, 2004
Solder ball attaching process
ADVANCED SEMICONDUCTOR ENG8 citations74
US6724075B2Apr 20, 2004
Semiconductor chip package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG8 citations74
US6723630B2Apr 20, 2004
Solder ball fabrication process
ADVANCED SEMICONDUCTOR ENG7 citations74
US6720244B2Apr 13, 2004
Bump fabrication method
ADVANCED SEMICONDUCTOR ENG7 citations74
US6891274B2May 10, 2005
Under-bump-metallurgy layer for improving adhesion
ADVANCED SEMICONDUCTOR ENG6 citations73
US7064428B2Jun 20, 2006
Wafer-level package structure
ADVANCED SEMICONDUCTOR ENG6 citations63
US6967153B2Nov 22, 2005
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG2 citations63
US6927964B2Aug 9, 2005
Structure for preventing burnt fuse pad from further electrical connection
ADVANCED SEMICONDUCTOR ENG4 citations63
US6875683B2Apr 5, 2005
Method of forming bump
ADVANCED SEMICONDUCTOR ENG4 citations63
US6756256B2Jun 29, 2004
Method for preventing burnt fuse pad from further electrical connection
ADVANCED SEMICONDUCTOR ENG2 citations63
US6743707B2Jun 1, 2004
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG3 citations63
US6716739B2Apr 6, 2004
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG4 citations63
US6714421B2Mar 30, 2004
Flip chip package substrate
ADVANCED SEMICONDUCTOR ENG3 citations63
US6469399B2Oct 22, 2002
Semiconductor package
ADVANCED SEMICONDUCTOR ENG6 citations63
US6312976B1Nov 6, 2001
Method for manufacturing leadless semiconductor chip package
ADVANCED SEMICONDUCTOR ENG4 citations63
US6429049B1Aug 6, 2002
Laser method for forming vias
ADVANCED SEMICONDUCTOR ENG3 citations57
US6877653B2Apr 12, 2005
Method of modifying tin to lead ratio in tin-lead bump
ADVANCED SEMICONDUCTOR ENG1 citations52
US6713320B2Mar 30, 2004
Bumping process
ADVANCED SEMICONDUCTOR ENG1 citations52