Inventor
FANG JEN-KUANG
TW48 patents
⚠️ This page may combine multiple inventors who share the name “FANG JEN-KUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
47 patentsUS7041534B2May 9, 2006
Semiconductor chip package and method for making the same
ADVANCED SEMICONDUCTOR ENG70 citations98
US7262497B2Aug 28, 2007
Bumpless assembly package
ADVANCED SEMICONDUCTOR ENG21 citations92
US6861346B2Mar 1, 2005
Solder ball fabricating process
ADVANCED SEMICONDUCTOR ENG21 citations92
US6820329B2Nov 23, 2004
Method of manufacturing multi-chip stacking package
ADVANCED SEMICONDUCTOR ENG25 citations92
US6692581B2Feb 17, 2004
Solder paste for fabricating bump
ADVANCED SEMICONDUCTOR ENG18 citations92
US6673711B2Jan 6, 2004
Solder ball fabricating process
ADVANCED SEMICONDUCTOR ENG19 citations92
US6664128B2Dec 16, 2003
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG25 citations92
US6153939ANov 28, 2000
Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same
ADVANCED SEMICONDUCTOR ENG22 citations92
US6737353B2May 18, 2004
Semiconductor device having bump electrodes
ADVANCED SEMICONDUCTOR ENG24 citations88
US6933616B2Aug 23, 2005
Multi-chip module packaging device using flip-chip bonding technology
ADVANCED SEMICONDUCTOR ENG17 citations84
US6878963B2Apr 12, 2005
Device for testing electrical characteristics of chips
ADVANCED SEMICONDUCTOR ENG12 citations84
US6846719B2Jan 25, 2005
Process for fabricating wafer bumps
ADVANCED SEMICONDUCTOR ENG16 citations84
US6827252B2Dec 7, 2004
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG18 citations84
US6713870B2Mar 30, 2004
Wafer level chip-scale package
ADVANCED SEMICONDUCTOR ENG16 citations84
US6617237B1Sep 9, 2003
Lead-free bump fabrication process
ADVANCED SEMICONDUCTOR ENG19 citations84
US7375020B2May 20, 2008
Method of forming bumps
ADVANCED SEMICONDUCTOR ENG6 citations74
US6989326B2Jan 24, 2006
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG10 citations74
US6916732B2Jul 12, 2005
Method of forming bumps
ADVANCED SEMICONDUCTOR ENG11 citations74
US6732912B2May 11, 2004
Solder ball attaching process
ADVANCED SEMICONDUCTOR ENG8 citations74
US6723630B2Apr 20, 2004
Solder ball fabrication process
ADVANCED SEMICONDUCTOR ENG7 citations74
US6720244B2Apr 13, 2004
Bump fabrication method
ADVANCED SEMICONDUCTOR ENG7 citations74
US6342443B1Jan 29, 2002
Method and structure for forming flip chip with collapse-controlled solder bumps on a substrate
ADVANCED SEMICONDUCTOR ENG11 citations74
US6150730ANov 21, 2000
Chip-scale semiconductor package
ADVANCED SEMICONDUCTOR ENG8 citations74
US11024569B2Jun 1, 2021
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations73
US10269672B2Apr 23, 2019
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations73
US10224301B2Mar 5, 2019
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations73
US7384566B2Jun 10, 2008
Fabrication method for printed circuit board
ADVANCED SEMICONDUCTOR ENG7 citations72
US10566279B2Feb 18, 2020
Package device, semiconductor device, and method for manufacturing the package device
ADVANCED SEMICONDUCTOR ENG4 citations68
US7064428B2Jun 20, 2006
Wafer-level package structure
ADVANCED SEMICONDUCTOR ENG6 citations63
US6972583B2Dec 6, 2005
Method for testing electrical characteristics of bumps
ADVANCED SEMICONDUCTOR ENG2 citations63
US6967153B2Nov 22, 2005
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG2 citations63
US6927964B2Aug 9, 2005
Structure for preventing burnt fuse pad from further electrical connection
ADVANCED SEMICONDUCTOR ENG4 citations63
US6875683B2Apr 5, 2005
Method of forming bump
ADVANCED SEMICONDUCTOR ENG4 citations63
US6838311B2Jan 4, 2005
Flip chip package and method for forming the same
ADVANCED SEMICONDUCTOR ENG4 citations63
US6756256B2Jun 29, 2004
Method for preventing burnt fuse pad from further electrical connection
ADVANCED SEMICONDUCTOR ENG2 citations63
US6743707B2Jun 1, 2004
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG3 citations63
US6716739B2Apr 6, 2004
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG4 citations63
US6469399B2Oct 22, 2002
Semiconductor package
ADVANCED SEMICONDUCTOR ENG6 citations63
US7726544B2Jun 1, 2010
Method of packaging flip chip and method of forming pre-solders on substrate thereof
ADVANCED SEMICONDUCTOR ENG6 citations54
US10685934B2Jun 16, 2020
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations52
US10672696B2Jun 2, 2020
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations52
US10636745B2Apr 28, 2020
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations52
US6924557B2Aug 2, 2005
Semiconductor package
ADVANCED SEMICONDUCTOR ENG1 citations52
US6877653B2Apr 12, 2005
Method of modifying tin to lead ratio in tin-lead bump
ADVANCED SEMICONDUCTOR ENG1 citations52
US6713320B2Mar 30, 2004
Bumping process
ADVANCED SEMICONDUCTOR ENG1 citations52
US10818636B2Oct 27, 2020
Substrate panel structure and manufacturing process
ADVANCED SEMICONDUCTOR ENG0 citations42
US9748196B2Aug 29, 2017
Semiconductor package structure including die and substrate electrically connected through conductive segments
ADVANCED SEMICONDUCTOR ENG0 citations41