Inventor
CHEN JAU-SHOUNG
TW24 patents
⚠️ This page may combine multiple inventors who share the name “CHEN JAU-SHOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
23 patentsUS6861346B2Mar 1, 2005
Solder ball fabricating process
ADVANCED SEMICONDUCTOR ENG21 citations92
US6673711B2Jan 6, 2004
Solder ball fabricating process
ADVANCED SEMICONDUCTOR ENG19 citations92
US6664128B2Dec 16, 2003
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG25 citations92
US7538421B2May 26, 2009
Flip-chip package structure with stiffener
ADVANCED SEMICONDUCTOR ENG10 citations84
US6846719B2Jan 25, 2005
Process for fabricating wafer bumps
ADVANCED SEMICONDUCTOR ENG16 citations84
US6827252B2Dec 7, 2004
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG18 citations84
US6617237B1Sep 9, 2003
Lead-free bump fabrication process
ADVANCED SEMICONDUCTOR ENG19 citations84
US6989326B2Jan 24, 2006
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG10 citations74
US6732912B2May 11, 2004
Solder ball attaching process
ADVANCED SEMICONDUCTOR ENG8 citations74
US6723630B2Apr 20, 2004
Solder ball fabrication process
ADVANCED SEMICONDUCTOR ENG7 citations74
US6720244B2Apr 13, 2004
Bump fabrication method
ADVANCED SEMICONDUCTOR ENG7 citations74
US7614888B2Nov 10, 2009
Flip chip package process
ADVANCED SEMICONDUCTOR ENG7 citations72
US7064428B2Jun 20, 2006
Wafer-level package structure
ADVANCED SEMICONDUCTOR ENG6 citations63
US6967153B2Nov 22, 2005
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG2 citations63
US6939790B2Sep 6, 2005
Wafer bumping process with solder balls bonded to under bump metallurgy layer formed over active surface by forming flux on solder ball surfaces and reflowing the solder
ADVANCED SEMICONDUCTOR ENG5 citations63
US6927964B2Aug 9, 2005
Structure for preventing burnt fuse pad from further electrical connection
ADVANCED SEMICONDUCTOR ENG4 citations63
US6908842B2Jun 21, 2005
Bumping process
ADVANCED SEMICONDUCTOR ENG5 citations63
US6875683B2Apr 5, 2005
Method of forming bump
ADVANCED SEMICONDUCTOR ENG4 citations63
US6756256B2Jun 29, 2004
Method for preventing burnt fuse pad from further electrical connection
ADVANCED SEMICONDUCTOR ENG2 citations63
US6743707B2Jun 1, 2004
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG3 citations63
US6716739B2Apr 6, 2004
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG4 citations63
US6877653B2Apr 12, 2005
Method of modifying tin to lead ratio in tin-lead bump
ADVANCED SEMICONDUCTOR ENG1 citations52
US6713320B2Mar 30, 2004
Bumping process
ADVANCED SEMICONDUCTOR ENG1 citations52