Inventor
SU CHING-HUEI
TW28 patents
⚠️ This page may combine multiple inventors who share the name “SU CHING-HUEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
27 patentsUS7253519B2Aug 7, 2007
Chip packaging structure having redistribution layer with recess
ADVANCED SEMICONDUCTOR ENG57 citations96
US7741152B2Jun 22, 2010
Three-dimensional package and method of making the same
ADVANCED SEMICONDUCTOR ENG44 citations92
US7642132B2Jan 5, 2010
Three-dimensional package and method of making the same
ADVANCED SEMICONDUCTOR ENG24 citations92
US7528053B2May 5, 2009
Three-dimensional package and method of making the same
ADVANCED SEMICONDUCTOR ENG31 citations92
US7446404B2Nov 4, 2008
Three-dimensional package and method of making the same
ADVANCED SEMICONDUCTOR ENG18 citations92
US6861346B2Mar 1, 2005
Solder ball fabricating process
ADVANCED SEMICONDUCTOR ENG21 citations92
US6673711B2Jan 6, 2004
Solder ball fabricating process
ADVANCED SEMICONDUCTOR ENG19 citations92
US6664128B2Dec 16, 2003
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG25 citations92
US6221697B1Apr 24, 2001
Chip scale package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG21 citations88
US6921716B2Jul 26, 2005
Wafer bumping process
ADVANCED SEMICONDUCTOR ENG16 citations84
US6846719B2Jan 25, 2005
Process for fabricating wafer bumps
ADVANCED SEMICONDUCTOR ENG16 citations84
US6827252B2Dec 7, 2004
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG18 citations84
US6617237B1Sep 9, 2003
Lead-free bump fabrication process
ADVANCED SEMICONDUCTOR ENG19 citations84
US6265768B1Jul 24, 2001
Chip scale package
ADVANCED SEMICONDUCTOR ENG19 citations84
US6989326B2Jan 24, 2006
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG10 citations74
US6732912B2May 11, 2004
Solder ball attaching process
ADVANCED SEMICONDUCTOR ENG8 citations74
US6723630B2Apr 20, 2004
Solder ball fabrication process
ADVANCED SEMICONDUCTOR ENG7 citations74
US6720244B2Apr 13, 2004
Bump fabrication method
ADVANCED SEMICONDUCTOR ENG7 citations74
US7064428B2Jun 20, 2006
Wafer-level package structure
ADVANCED SEMICONDUCTOR ENG6 citations63
US6967153B2Nov 22, 2005
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG2 citations63
US6927964B2Aug 9, 2005
Structure for preventing burnt fuse pad from further electrical connection
ADVANCED SEMICONDUCTOR ENG4 citations63
US6875683B2Apr 5, 2005
Method of forming bump
ADVANCED SEMICONDUCTOR ENG4 citations63
US6756256B2Jun 29, 2004
Method for preventing burnt fuse pad from further electrical connection
ADVANCED SEMICONDUCTOR ENG2 citations63
US6743707B2Jun 1, 2004
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG3 citations63
US6716739B2Apr 6, 2004
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG4 citations63
US6877653B2Apr 12, 2005
Method of modifying tin to lead ratio in tin-lead bump
ADVANCED SEMICONDUCTOR ENG1 citations52
US6713320B2Mar 30, 2004
Bumping process
ADVANCED SEMICONDUCTOR ENG1 citations52