Inventor
WENG CHAO-FU
TW33 patents
⚠️ This page may combine multiple inventors who share the name “WENG CHAO-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
30 patentsUS7253519B2Aug 7, 2007
Chip packaging structure having redistribution layer with recess
ADVANCED SEMICONDUCTOR ENG57 citations96
US6861346B2Mar 1, 2005
Solder ball fabricating process
ADVANCED SEMICONDUCTOR ENG21 citations92
US6720243B2Apr 13, 2004
Bump fabrication method
ADVANCED SEMICONDUCTOR ENG27 citations92
US6673711B2Jan 6, 2004
Solder ball fabricating process
ADVANCED SEMICONDUCTOR ENG19 citations92
US6664128B2Dec 16, 2003
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG25 citations92
US6921716B2Jul 26, 2005
Wafer bumping process
ADVANCED SEMICONDUCTOR ENG16 citations84
US6867122B2Mar 15, 2005
Redistribution process
ADVANCED SEMICONDUCTOR ENG16 citations84
US6846719B2Jan 25, 2005
Process for fabricating wafer bumps
ADVANCED SEMICONDUCTOR ENG16 citations84
US6827252B2Dec 7, 2004
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG18 citations84
US6617237B1Sep 9, 2003
Lead-free bump fabrication process
ADVANCED SEMICONDUCTOR ENG19 citations84
US6989326B2Jan 24, 2006
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG10 citations74
US6812124B2Nov 2, 2004
Chip structure with bumps and a process for fabricating the same
ADVANCED SEMICONDUCTOR ENG9 citations74
US6732912B2May 11, 2004
Solder ball attaching process
ADVANCED SEMICONDUCTOR ENG8 citations74
US6723630B2Apr 20, 2004
Solder ball fabrication process
ADVANCED SEMICONDUCTOR ENG7 citations74
US6720244B2Apr 13, 2004
Bump fabrication method
ADVANCED SEMICONDUCTOR ENG7 citations74
US9955590B2Apr 24, 2018
Redistribution layer structure, semiconductor substrate structure, semiconductor package structure, chip structure, and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations73
US7547575B2Jun 16, 2009
Two-stage die-bonding method for simultaneous die-bonding of multiple dies
ADVANCED SEMICONDUCTOR ENG7 citations71
US7015130B2Mar 21, 2006
Method for making UBM pads and bumps on wafer
ADVANCED SEMICONDUCTOR ENG9 citations69
US7064428B2Jun 20, 2006
Wafer-level package structure
ADVANCED SEMICONDUCTOR ENG6 citations63
US6967153B2Nov 22, 2005
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG2 citations63
US6927964B2Aug 9, 2005
Structure for preventing burnt fuse pad from further electrical connection
ADVANCED SEMICONDUCTOR ENG4 citations63
US6875683B2Apr 5, 2005
Method of forming bump
ADVANCED SEMICONDUCTOR ENG4 citations63
US6756256B2Jun 29, 2004
Method for preventing burnt fuse pad from further electrical connection
ADVANCED SEMICONDUCTOR ENG2 citations63
US6743707B2Jun 1, 2004
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG3 citations63
US6716739B2Apr 6, 2004
Bump manufacturing method
ADVANCED SEMICONDUCTOR ENG4 citations63
US7261828B2Aug 28, 2007
Bumping process
ADVANCED SEMICONDUCTOR ENG2 citations60
US7144801B2Dec 5, 2006
Bumping process to increase bump height
ADVANCED SEMICONDUCTOR ENG0 citations52
US6877653B2Apr 12, 2005
Method of modifying tin to lead ratio in tin-lead bump
ADVANCED SEMICONDUCTOR ENG1 citations52
US6713320B2Mar 30, 2004
Bumping process
ADVANCED SEMICONDUCTOR ENG1 citations52
US7581666B2Sep 1, 2009
Wire-bonding method for wire-bonding apparatus
ADVANCED SEMICONDUCTOR ENG1 citations49