Inventor
WU TSUNG-HUA
TW19 patents
⚠️ This page may combine multiple inventors who share the name “WU TSUNG-HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
16 patentsUS6692581B2Feb 17, 2004
Solder paste for fabricating bump
ADVANCED SEMICONDUCTOR ENG18 citations92
US6664128B2Dec 16, 2003
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG25 citations92
US6846719B2Jan 25, 2005
Process for fabricating wafer bumps
ADVANCED SEMICONDUCTOR ENG16 citations84
US6617237B1Sep 9, 2003
Lead-free bump fabrication process
ADVANCED SEMICONDUCTOR ENG19 citations84
US7375020B2May 20, 2008
Method of forming bumps
ADVANCED SEMICONDUCTOR ENG6 citations74
US6916732B2Jul 12, 2005
Method of forming bumps
ADVANCED SEMICONDUCTOR ENG11 citations74
US6732912B2May 11, 2004
Solder ball attaching process
ADVANCED SEMICONDUCTOR ENG8 citations74
US6720244B2Apr 13, 2004
Bump fabrication method
ADVANCED SEMICONDUCTOR ENG7 citations74
US7518241B2Apr 14, 2009
Wafer structure with a multi-layer barrier in an UBM layer network device with power supply
ADVANCED SEMICONDUCTOR ENG7 citations69
US7221052B2May 22, 2007
Chip scale package with micro antenna and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations63
US7064428B2Jun 20, 2006
Wafer-level package structure
ADVANCED SEMICONDUCTOR ENG6 citations63
US6967153B2Nov 22, 2005
Bump fabrication process
ADVANCED SEMICONDUCTOR ENG2 citations63
US6927964B2Aug 9, 2005
Structure for preventing burnt fuse pad from further electrical connection
ADVANCED SEMICONDUCTOR ENG4 citations63
US6756256B2Jun 29, 2004
Method for preventing burnt fuse pad from further electrical connection
ADVANCED SEMICONDUCTOR ENG2 citations63
US6877653B2Apr 12, 2005
Method of modifying tin to lead ratio in tin-lead bump
ADVANCED SEMICONDUCTOR ENG1 citations52
US6713320B2Mar 30, 2004
Bumping process
ADVANCED SEMICONDUCTOR ENG1 citations52