Inventor
FULCHER EDWIN M
US10 patents
Patents
10 patentsUS6008534ADec 28, 1999
Integrated circuit package having signal traces interposed between power and ground conductors in order to form stripline transmission lines
LSI LOGIC CORP92 citations96
US6798035B1Sep 28, 2004
Bonding pad for low k dielectric
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US6762366B1Jul 13, 2004
Ball assignment for ball grid array package
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US6671865B1Dec 30, 2003
High density input output
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US6744130B1Jun 1, 2004
Isolated stripline structure
LSI LOGIC CORP18 citations83
US6459049B1Oct 1, 2002
High density signal routing
LSI LOGIC CORP14 citations83
US6791177B1Sep 14, 2004
Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate
LSI LOGIC CORP8 citations73
US6963129B1Nov 8, 2005
Multi-chip package having a contiguous heat spreader assembly
LSI LOGIC CORP8 citations72
US6828643B2Dec 7, 2004
Bonding pads over input circuits
LSI LOGIC CORP4 citations61
US6867488B2Mar 15, 2005
Thick metal top layer
LSI LOGIC CORP0 citations51