Inventor

MIRANDA CORBALAN MIGUEL

US2 patents

Patents

2 patents

US11626359B2Apr 11, 2023

Three-dimensional integrated circuit (3D IC) power distribution network (PDN) capacitor integration

QUALCOMM INC1 citations57

US10109724B2Oct 23, 2018

Heterojunction bipolar transistor unit cell and power stage for a power amplifier

QUALCOMM INC0 citations48