P

Inventor

WEIMER RONALD A

US96 patents
⚠️ This page may combine multiple inventors who share the name “WEIMER RONALD A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

46 patents
US7422635B2Sep 9, 2008

Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces

MICRON TECHNOLOGY INC483 citations99
US6559007B1May 6, 2003

Method for forming flash memory device having a tunnel dielectric comprising nitrided oxide

MICRON TECHNOLOGY INC96 citations99
US6462371B1Oct 8, 2002

Films doped with carbon for use in integrated circuit technology

MICRON TECHNOLOGY INC269 citations99
US6455372B1Sep 24, 2002

Nucleation for improved flash erase characteristics

MICRON TECHNOLOGY INC221 citations99
US6362086B2Mar 26, 2002

Forming a conductive structure in a semiconductor device

MICRON TECHNOLOGY INC108 citations98
US6348380B1Feb 19, 2002

Use of dilute steam ambient for improvement of flash devices

MICRON TECHNOLOGY INC325 citations98
US7019351B2Mar 28, 2006

Transistor devices, and methods of forming transistor devices and circuit devices

MICRON TECHNOLOGY INC74 citations97
US6815805B2Nov 9, 2004

Method of fabricating an integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source

MICRON TECHNOLOGY INC56 citations96
US6544908B1Apr 8, 2003

Ammonia gas passivation on nitride encapsulated devices

MICRON TECHNOLOGY INC40 citations96
US6410968B1Jun 25, 2002

Semiconductor device with barrier layer

MICRON TECHNOLOGY INC31 citations96
US6291868B1Sep 18, 2001

Forming a conductive structure in a semiconductor device

MICRON TECHNOLOGY INC76 citations96
US6162737ADec 19, 2000

Films doped with carbon for use in integrated circuit technology

MICRON TECHNOLOGY INC36 citations96
US5930106AJul 27, 1999

DRAM capacitors made from silicon-germanium and electrode-limited conduction dielectric films

MICRON TECHNOLOGY INC51 citations96
US5759262AJun 2, 1998

Method of forming hemispherical grained silicon

MICRON TECHNOLOGY INC86 citations96
US7084448B2Aug 1, 2006

Double sided container process used during the manufacture of a semiconductor device

MICRON TECHNOLOGY INC14 citations93
US6734531B2May 11, 2004

Use of selective oxidation conditions for dielectric conditioning

MICRON TECHNOLOGY INC13 citations93
US6696336B2Feb 24, 2004

Double sided container process used during the manufacture of a semiconductor device

MICRON TECHNOLOGY INC19 citations93
US6592661B1Jul 15, 2003

Method for processing wafers in a semiconductor fabrication system

MICRON TECHNOLOGY INC33 citations93
US6150208ANov 21, 2000

DRAM capacitors made from silicon-germanium and electrode-limited conduction dielectric films

MICRON TECHNOLOGY INC40 citations93
US7898850B2Mar 1, 2011

Memory cells, electronic systems, methods of forming memory cells, and methods of programming memory cells

MICRON TECHNOLOGY INC23 citations92
US7647886B2Jan 19, 2010

Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers

MICRON TECHNOLOGY INC45 citations92
US7253053B2Aug 7, 2007

Methods of forming transistor devices and capacitor constructions

MICRON TECHNOLOGY INC14 citations92
US7245010B2Jul 17, 2007

System and device including a barrier layer

MICRON TECHNOLOGY INC20 citations92
US7173304B2Feb 6, 2007

Method of manufacturing devices comprising conductive nano-dots, and devices comprising same

MICRON TECHNOLOGY INC26 citations92
US7081656B2Jul 25, 2006

CMOS constructions

MICRON TECHNOLOGY INC15 citations92
US7056806B2Jun 6, 2006

Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces

MICRON TECHNOLOGY INC23 citations92
US6596595B1Jul 22, 2003

Forming a conductive structure in a semiconductor device

MICRON TECHNOLOGY INC16 citations92
US6475883B2Nov 5, 2002

Method for forming a barrier layer

MICRON TECHNOLOGY INC29 citations92
US5962065AOct 5, 1999

Method of forming polysilicon having a desired surface roughness

MICRON TECHNOLOGY INC39 citations92
US5688550ANov 18, 1997

Method of forming polysilicon having a desired surface roughness

MICRON TECHNOLOGY INC23 citations92
US7906393B2Mar 15, 2011

Methods for forming small-scale capacitor structures

MICRON TECHNOLOGY INC8 citations84
US7344755B2Mar 18, 2008

Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers

MICRON TECHNOLOGY INC10 citations84
US7258892B2Aug 21, 2007

Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition

MICRON TECHNOLOGY INC13 citations84
US7235138B2Jun 26, 2007

Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces

MICRON TECHNOLOGY INC14 citations84
US6972223B2Dec 6, 2005

Use of atomic oxygen process for improved barrier layer

MICRON TECHNOLOGY INC12 citations84
US6949789B2Sep 27, 2005

Use of dilute steam ambient for improvement of flash devices

MICRON TECHNOLOGY INC10 citations82
US6713807B2Mar 30, 2004

Films doped with carbon for use in integrated circuit technology

MICRON TECHNOLOGY INC12 citations82
US6576979B2Jun 10, 2003

Use of selective oxidation conditions for dielectric conditioning

MICRON TECHNOLOGY INC11 citations82
US6555487B1Apr 29, 2003

Method of selective oxidation conditions for dielectric conditioning

MICRON TECHNOLOGY INC12 citations82
US7915126B2Mar 29, 2011

Methods of forming non-volatile memory cells, and methods of forming NAND cell unit string gates

MICRON TECHNOLOGY INC4 citations74
US7771537B2Aug 10, 2010

Methods and systems for controlling temperature during microfeature workpiece processing, E.G. CVD deposition

MICRON TECHNOLOGY INC5 citations74
US7470583B2Dec 30, 2008

Method of improved high K dielectric-polysilicon interface for CMOS devices

MICRON TECHNOLOGY INC4 citations74
US7279398B2Oct 9, 2007

Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces

MICRON TECHNOLOGY INC6 citations74
US7264768B2Sep 4, 2007

Single substrate annealing of magnetoresistive structure

MICRON TECHNOLOGY INC8 citations74
US7087182B2Aug 8, 2006

Process of forming an electrically erasable programmable read only memory with an oxide layer exposed to hydrogen and nitrogen

MICRON TECHNOLOGY INC4 citations74
US6963101B2Nov 8, 2005

Films doped with carbon for use in integrated circuit technology

MICRON TECHNOLOGY INC5 citations74

QLOGIC CORP

2 patents

MICRON TECHNOLOGIES INC

1 patent

MIN KYU S

1 patent

Showing the top 50 of 96 patents by PatentIndex Score.