Inventor
WEIMER RONALD A
US96 patents
⚠️ This page may combine multiple inventors who share the name “WEIMER RONALD A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
46 patentsUS7422635B2Sep 9, 2008
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
MICRON TECHNOLOGY INC483 citations99
US6559007B1May 6, 2003
Method for forming flash memory device having a tunnel dielectric comprising nitrided oxide
MICRON TECHNOLOGY INC96 citations99
US6462371B1Oct 8, 2002
Films doped with carbon for use in integrated circuit technology
MICRON TECHNOLOGY INC269 citations99
US6455372B1Sep 24, 2002
Nucleation for improved flash erase characteristics
MICRON TECHNOLOGY INC221 citations99
US6362086B2Mar 26, 2002
Forming a conductive structure in a semiconductor device
MICRON TECHNOLOGY INC108 citations98
US6348380B1Feb 19, 2002
Use of dilute steam ambient for improvement of flash devices
MICRON TECHNOLOGY INC325 citations98
US7019351B2Mar 28, 2006
Transistor devices, and methods of forming transistor devices and circuit devices
MICRON TECHNOLOGY INC74 citations97
US6815805B2Nov 9, 2004
Method of fabricating an integrated circuit with a dielectric layer exposed to a hydrogen-bearing nitrogen source
MICRON TECHNOLOGY INC56 citations96
US6544908B1Apr 8, 2003
Ammonia gas passivation on nitride encapsulated devices
MICRON TECHNOLOGY INC40 citations96
US6410968B1Jun 25, 2002
Semiconductor device with barrier layer
MICRON TECHNOLOGY INC31 citations96
US6291868B1Sep 18, 2001
Forming a conductive structure in a semiconductor device
MICRON TECHNOLOGY INC76 citations96
US6162737ADec 19, 2000
Films doped with carbon for use in integrated circuit technology
MICRON TECHNOLOGY INC36 citations96
US5930106AJul 27, 1999
DRAM capacitors made from silicon-germanium and electrode-limited conduction dielectric films
MICRON TECHNOLOGY INC51 citations96
US5759262AJun 2, 1998
Method of forming hemispherical grained silicon
MICRON TECHNOLOGY INC86 citations96
US7084448B2Aug 1, 2006
Double sided container process used during the manufacture of a semiconductor device
MICRON TECHNOLOGY INC14 citations93
US6734531B2May 11, 2004
Use of selective oxidation conditions for dielectric conditioning
MICRON TECHNOLOGY INC13 citations93
US6696336B2Feb 24, 2004
Double sided container process used during the manufacture of a semiconductor device
MICRON TECHNOLOGY INC19 citations93
US6592661B1Jul 15, 2003
Method for processing wafers in a semiconductor fabrication system
MICRON TECHNOLOGY INC33 citations93
US6150208ANov 21, 2000
DRAM capacitors made from silicon-germanium and electrode-limited conduction dielectric films
MICRON TECHNOLOGY INC40 citations93
US7898850B2Mar 1, 2011
Memory cells, electronic systems, methods of forming memory cells, and methods of programming memory cells
MICRON TECHNOLOGY INC23 citations92
US7647886B2Jan 19, 2010
Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
MICRON TECHNOLOGY INC45 citations92
US7253053B2Aug 7, 2007
Methods of forming transistor devices and capacitor constructions
MICRON TECHNOLOGY INC14 citations92
US7245010B2Jul 17, 2007
System and device including a barrier layer
MICRON TECHNOLOGY INC20 citations92
US7173304B2Feb 6, 2007
Method of manufacturing devices comprising conductive nano-dots, and devices comprising same
MICRON TECHNOLOGY INC26 citations92
US7081656B2Jul 25, 2006
CMOS constructions
MICRON TECHNOLOGY INC15 citations92
US7056806B2Jun 6, 2006
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
MICRON TECHNOLOGY INC23 citations92
US6596595B1Jul 22, 2003
Forming a conductive structure in a semiconductor device
MICRON TECHNOLOGY INC16 citations92
US6475883B2Nov 5, 2002
Method for forming a barrier layer
MICRON TECHNOLOGY INC29 citations92
US5962065AOct 5, 1999
Method of forming polysilicon having a desired surface roughness
MICRON TECHNOLOGY INC39 citations92
US5688550ANov 18, 1997
Method of forming polysilicon having a desired surface roughness
MICRON TECHNOLOGY INC23 citations92
US7906393B2Mar 15, 2011
Methods for forming small-scale capacitor structures
MICRON TECHNOLOGY INC8 citations84
US7344755B2Mar 18, 2008
Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
MICRON TECHNOLOGY INC10 citations84
US7258892B2Aug 21, 2007
Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
MICRON TECHNOLOGY INC13 citations84
US7235138B2Jun 26, 2007
Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
MICRON TECHNOLOGY INC14 citations84
US6972223B2Dec 6, 2005
Use of atomic oxygen process for improved barrier layer
MICRON TECHNOLOGY INC12 citations84
US6949789B2Sep 27, 2005
Use of dilute steam ambient for improvement of flash devices
MICRON TECHNOLOGY INC10 citations82
US6713807B2Mar 30, 2004
Films doped with carbon for use in integrated circuit technology
MICRON TECHNOLOGY INC12 citations82
US6576979B2Jun 10, 2003
Use of selective oxidation conditions for dielectric conditioning
MICRON TECHNOLOGY INC11 citations82
US6555487B1Apr 29, 2003
Method of selective oxidation conditions for dielectric conditioning
MICRON TECHNOLOGY INC12 citations82
US7915126B2Mar 29, 2011
Methods of forming non-volatile memory cells, and methods of forming NAND cell unit string gates
MICRON TECHNOLOGY INC4 citations74
US7771537B2Aug 10, 2010
Methods and systems for controlling temperature during microfeature workpiece processing, E.G. CVD deposition
MICRON TECHNOLOGY INC5 citations74
US7470583B2Dec 30, 2008
Method of improved high K dielectric-polysilicon interface for CMOS devices
MICRON TECHNOLOGY INC4 citations74
US7279398B2Oct 9, 2007
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
MICRON TECHNOLOGY INC6 citations74
US7264768B2Sep 4, 2007
Single substrate annealing of magnetoresistive structure
MICRON TECHNOLOGY INC8 citations74
US7087182B2Aug 8, 2006
Process of forming an electrically erasable programmable read only memory with an oxide layer exposed to hydrogen and nitrogen
MICRON TECHNOLOGY INC4 citations74
US6963101B2Nov 8, 2005
Films doped with carbon for use in integrated circuit technology
MICRON TECHNOLOGY INC5 citations74
QLOGIC CORP
2 patentsMICRON TECHNOLOGIES INC
1 patentMIN KYU S
1 patentShowing the top 50 of 96 patents by PatentIndex Score.