Inventor

DAIZO TOMOYA

JP4 patents

Patents

4 patents

US12033927B2Jul 9, 2024

Method for manufacturing wiring substrate

IBIDEN CO LTD0 citations58

US11622446B2Apr 4, 2023

Wiring substrate

IBIDEN CO LTD1 citations58

US11935822B2Mar 19, 2024

Wiring substrate having metal post offset from conductor pad and method for manufacturing wiring substrate

IBIDEN CO LTD0 citations48

US9401320B2Jul 26, 2016

Combined substrate

IBIDEN CO LTD0 citations39