Inventor
CONNELL MIKE
US12 patents
⚠️ This page may combine multiple inventors who share the name “CONNELL MIKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
9 patentsUS6949834B2Sep 27, 2005
Stacked semiconductor package with circuit side polymer layer
MICRON TECHNOLOGY INC49 citations96
US6791168B1Sep 14, 2004
Semiconductor package with circuit side polymer layer and wafer level fabrication method
MICRON TECHNOLOGY INC40 citations96
US6995041B2Feb 7, 2006
Semiconductor package with circuit side polymer layer and wafer level fabrication method
MICRON TECHNOLOGY INC30 citations92
US7537966B2May 26, 2009
Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
MICRON TECHNOLOGY INC10 citations84
US6812064B2Nov 2, 2004
Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate
MICRON TECHNOLOGY INC13 citations83
US6881606B2Apr 19, 2005
Method for forming a protective layer for use in packaging a semiconductor die
MICRON TECHNOLOGY INC4 citations63
US7479413B2Jan 20, 2009
Method for fabricating semiconductor package with circuit side polymer layer
MICRON TECHNOLOGY INC2 citations62
US7078267B2Jul 18, 2006
Methods of fabricating integrated circuitry
MICRON TECHNOLOGY INC2 citations62
US7170184B2Jan 30, 2007
Treatment of a ground semiconductor die to improve adhesive bonding to a substrate
MICRON TECHNOLOGY INC1 citations51