Inventor
ONG YOU YANG
MY14 patents
⚠️ This page may combine multiple inventors who share the name “ONG YOU YANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
7 patentsUS7535086B2May 19, 2009
Integrated circuit package-on-package stacking system
STATS CHIPPAC LTD34 citations92
US7859098B2Dec 28, 2010
Embedded integrated circuit package system
STATS CHIPPAC LTD8 citations84
US7598600B2Oct 6, 2009
Stackable power semiconductor package system
STATS CHIPPAC LTD12 citations78
US7557432B2Jul 7, 2009
Thermally enhanced power semiconductor package system
STATS CHIPPAC LTD8 citations78
US7718472B2May 18, 2010
Integrated circuit package-on-package stacking system and method of manufacture thereof
STATS CHIPPAC LTD5 citations73
US7868434B2Jan 11, 2011
Integrated circuit package-on-package stacking system
STATS CHIPPAC LTD3 citations62
US7443018B2Oct 28, 2008
Integrated circuit package system including ribbon bond interconnect
STATS CHIPPAC LTD3 citations51
ONG YOU YANG
7 patentsUS8546929B2Oct 1, 2013
Embedded integrated circuit package-on-package system
ONG YOU YANG8 citations83
US8163604B2Apr 24, 2012
Integrated circuit package system using etched leadframe
ONG YOU YANG15 citations76
US8164182B2Apr 24, 2012
Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip
ONG YOU YANG9 citations76
US8803299B2Aug 12, 2014
Stacked integrated circuit package system
ONG YOU YANG6 citations71
US8093694B2Jan 10, 2012
Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures
ONG YOU YANG3 citations61
US8067832B2Nov 29, 2011
Embedded integrated circuit package system and method of manufacture thereof
ONG YOU YANG0 citations51
US8415786B2Apr 9, 2013
Thermally enhanced semiconductor package system
ONG YOU YANG0 citations44