Inventor

KAN KUAN MING

MY3 patents

⚠️ This page may combine multiple inventors who share the name “KAN KUAN MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

2 patents

US7598600B2Oct 6, 2009

Stackable power semiconductor package system

STATS CHIPPAC LTD12 citations78

US7557432B2Jul 7, 2009

Thermally enhanced power semiconductor package system

STATS CHIPPAC LTD8 citations78

SEMICONDUCTOR COMPONENTS IND

1 patent

US6436736B1Aug 20, 2002

Method for manufacturing a semiconductor package on a leadframe

SEMICONDUCTOR COMPONENTS IND5 citations57