Inventor
HU YONGZHONG
US26 patents
⚠️ This page may combine multiple inventors who share the name “HU YONGZHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ALPHA & OMEGA SEMICONDUCTOR
7 patentsUS7256446B2Aug 14, 2007
One time programmable memory cell
ALPHA & OMEGA SEMICONDUCTOR38 citations92
US7855422B2Dec 21, 2010
Formation of high sheet resistance resistors and high capacitance capacitors by a single polysilicon process
ALPHA & OMEGA SEMICONDUCTOR9 citations84
US7824977B2Nov 2, 2010
Completely decoupled high voltage and low voltage transistor manufacturing processes
ALPHA & OMEGA SEMICONDUCTOR7 citations74
US10008598B2Jun 26, 2018
Top drain LDMOS
ALPHA & OMEGA SEMICONDUCTOR2 citations73
US7829941B2Nov 9, 2010
Configuration and method to form MOSFET devices with low resistance silicide gate and mesa contact regions
ALPHA & OMEGA SEMICONDUCTOR3 citations63
US8022482B2Sep 20, 2011
Device configuration of asymmetrical DMOSFET with schottky barrier source
ALPHA & OMEGA SEMICONDUCTOR1 citations52
US7805687B2Sep 28, 2010
One-time programmable (OTP) memory cell
ALPHA & OMEGA SEMICONDUCTOR1 citations52
ADVANCED MICRO DEVICES INC
6 patentsUS6271087B1Aug 7, 2001
Method for forming self-aligned contacts and local interconnects using self-aligned local interconnects
ADVANCED MICRO DEVICES INC74 citations96
US6482699B1Nov 19, 2002
Method for forming self-aligned contacts and local interconnects using decoupled local interconnect process
ADVANCED MICRO DEVICES INC37 citations93
US6306713B1Oct 23, 2001
Method for forming self-aligned contacts and local interconnects for salicided gates using a secondary spacer
ADVANCED MICRO DEVICES INC40 citations93
US6506683B1Jan 14, 2003
In-situ process for fabricating a semiconductor device with integral removal of antireflection and etch stop layers
ADVANCED MICRO DEVICES INC10 citations74
US6348406B1Feb 19, 2002
Method for using a low dielectric constant layer as a semiconductor anti-reflective coating
ADVANCED MICRO DEVICES INC11 citations74
US6376389B1Apr 23, 2002
Method for eliminating anti-reflective coating in semiconductors
ADVANCED MICRO DEVICES INC5 citations63
LATTICE SEMICONDUCTOR CORP
5 patentsUS6693830B1Feb 17, 2004
Single-poly two-transistor EEPROM cell with differentially doped floating gate
LATTICE SEMICONDUCTOR CORP15 citations84
US6627947B1Sep 30, 2003
Compact single-poly two transistor EEPROM cell
LATTICE SEMICONDUCTOR CORP16 citations83
US6842372B1Jan 11, 2005
EEPROM cell having a floating-gate transistor within a cell well and a process for fabricating the memory cell
LATTICE SEMICONDUCTOR CORP8 citations74
US6794236B1Sep 21, 2004
Eeprom device with improved capacitive coupling and fabrication process
LATTICE SEMICONDUCTOR CORP10 citations74
US6797568B1Sep 28, 2004
Flash technology transistors and methods for forming the same
LATTICE SEMICONDUCTOR CORP3 citations63
HU YONGZHONG
4 patentsUS9337329B2May 10, 2016
Method of fabrication and device configuration of asymmetrical DMOSFET with schottky barrier source
HU YONGZHONG9 citations83
US8835251B2Sep 16, 2014
Formation of high sheet resistance resistors and high capacitance capacitors by a single polysilicon process
HU YONGZHONG2 citations61
US8105905B2Jan 31, 2012
Configuration and method to form MOSFET devices with low resistance silicide gate and mesa contact regions
HU YONGZHONG2 citations61
US8236653B2Aug 7, 2012
Configuration and method to form MOSFET devices with low resistance silicide gate and mesa contact regions
HU YONGZHONG0 citations51
TAI SUNG-SHAN
2 patentsUS8058687B2Nov 15, 2011
Split gate with different gate materials and work functions to reduce gate resistance of ultra high density MOSFET
TAI SUNG-SHAN6 citations73
US8524558B2Sep 3, 2013
Split gate with different gate materials and work functions to reduce gate resistance of ultra high density MOSFET
TAI SUNG-SHAN0 citations52