Inventor
KORENSTEIN RALPH
US23 patents
⚠️ This page may combine multiple inventors who share the name “KORENSTEIN RALPH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
15 patentsUS7968865B2Jun 28, 2011
Boron aluminum nitride diamond heterostructure
RAYTHEON CO21 citations92
US7884373B2Feb 8, 2011
Gallium nitride layer with diamond layers
RAYTHEON CO11 citations83
US4886683ADec 12, 1989
Low temperature metalorganic chemical vapor depostion growth of group II-VI semiconductor materials
RAYTHEON CO23 citations80
US7557378B2Jul 7, 2009
Boron aluminum nitride diamond heterostructure
RAYTHEON CO5 citations73
US10550041B1Feb 4, 2020
Fluoride-based nanocomposite materials for infrared window applications
RAYTHEON CO5 citations72
US7888171B2Feb 15, 2011
Fabricating a gallium nitride layer with diamond layers
RAYTHEON CO6 citations72
US12414278B2Sep 9, 2025
Method for protecting IR transmitting windows and domes from EMI
RAYTHEON CO0 citations62
US12468073B2Nov 11, 2025
Method of strengthening an optical element
RAYTHEON CO0 citations61
US11451309B2Sep 20, 2022
Apertures with dynamically variable electromagnetic properties
RAYTHEON CO0 citations61
US11402548B2Aug 2, 2022
Method of strengthening an optical element
RAYTHEON CO1 citations61
US7790072B2Sep 7, 2010
Treatment method for optically transmissive bodies
RAYTHEON CO6 citations57
US12248122B2Mar 11, 2025
SWIR-MWIR transparent, conductive coating for EMI protection of NCOC
RAYTHEON CO0 citations52
US7989261B2Aug 2, 2011
Fabricating a gallium nitride device with a diamond layer
RAYTHEON CO1 citations51
US10385220B2Aug 20, 2019
Long wave infrared transparent window and coating materials
RAYTHEON CO0 citations50
US10000642B2Jun 19, 2018
Long wave infrared transparent window and coating materials
RAYTHEON CO1 citations47
KORENSTEIN RALPH
3 patentsUS8174024B2May 8, 2012
Gallium nitride device with a diamond layer
KORENSTEIN RALPH3 citations60
US8698161B2Apr 15, 2014
Semiconductor structures having directly bonded diamond heat sinks and methods for making such structures
KORENSTEIN RALPH1 citations47
US8450185B2May 28, 2013
Semiconductor structures having directly bonded diamond heat sinks and methods for making such structures
KORENSTEIN RALPH1 citations47