Inventor

TERUI MAKOTO

JP71 patents

⚠️ This page may combine multiple inventors who share the name “TERUI MAKOTO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TERUI MAKOTO

OKI ELECTRIC IND CO LTD

Semiconductor device

Semiconductor device

BGA package and method for fabricating the same

Semiconductor apparatus with decoupling capacitor

Semiconductor chip and semiconductor device having the chip

Semiconductor chip with passive element in a wiring region of the chip

Semiconductor device with improved design freedom of external terminal

Semiconductor device

Semiconductor apparatus with decoupling capacitor

Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof

Semiconductor chip package

Semiconductor apparatus with decoupling capacitor

Semiconductor chip package

Method for fabricating a semiconductor device having a heat radiation layer including forming scribe lines and dicing

Semiconductor package and method of fabricating same

Semiconductor apparatus with decoupling capacitor

Semiconductor device and manufacturing method thereof

Electronic part mounting substrate, electronic part, and semiconductor device

Semiconductor apparatus with decoupling capacitor

Semiconductor apparatus with decoupling capacitor

CANON KK

Ink-jet head, ink-jet head substrate, and a method for making the head

Ink jet recording head, manufacturing method therefor, and substrate for ink jet recording head manufacture

Substrate unit for liquid discharging head, method for producing the same, liquid discharging head, cartridge, and image forming apparatus

Ink jet recording head and producing method therefor

Method for manufacturing a liquid jet recording head held in place by a vacuum using a single-point bonder with a particular tip construction and a head manufactured by this method

Ink jet recording head having structural members in ink supply port

Method of manufacturing substrate for ink jet recording head and method of manufacturing recording head using substrate manufactured by this method

Substrate processing method and ink jet recording head substrate manufacturing method

Beam, ink jet recording head having beams, and method for manufacturing ink jet recording head having beams

Liquid ejection print head

Method for manufacturing a liquid jet recording head and a liquid jet recording head manufactured by such method

Beam, ink jet recording head having beams, and method for manufacturing ink jet recording head having beams

Ink-jet recording head, method for manufacturing ink-jet recording head, and semiconductor device

Beam, ink jet recording head having beams, and method for manufacturing ink jet recording head having beams

Ink jet recording head, manufacturing method therefor, and substrate for ink jet recording head manufacture

IBIDEN CO LTD

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring board with cavity for built-in electronic component and method for manufacturing the same

Printed wiring board, method for manufacturing the same and semiconductor device

Wiring board and method for manufacturing the same

Wiring board with built-in electronic component and method for manufacturing the same

Wiring substrate and method for manufacturing the same

OKI SEMICONDUCTOR CO LTD

Semiconductor device and manufacturing method thereof

Method of producing a semiconductor device having a magnetic layer formed thereon

Semiconductor device that suppresses variations in high frequency characteristics of circuit elements

Method for fabricating a semiconductor device having a heat radiation layer

Fabrication method for chip size package and non-chip size package semiconductor devices

UYAMA MASAYA

Liquid ejection head and manufacturing method thereof

TERUI MAKOTO

Semiconductor device manufacturing method

OUCHI SHINJI

Wiring board and method for manufacturing the same