Inventor
SPROGIS EDMUND
US7 patents
⚠️ This page may combine multiple inventors who share the name “SPROGIS EDMUND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
5 patentsUS7462509B2Dec 9, 2008
Dual-sided chip attached modules
IBM10 citations84
US6452265B1Sep 17, 2002
Multi-chip module utilizing a nonconductive material surrounding the chips that has a similar coefficient of thermal expansion
IBM16 citations84
US6949458B2Sep 27, 2005
Self-aligned contact areas for sidewall image transfer formed conductors
IBM7 citations73
US6566759B1May 20, 2003
Self-aligned contact areas for sidewall image transfer formed conductors
IBM12 citations73
US7863734B2Jan 4, 2011
Dual-sided chip attached modules
IBM0 citations52