Inventor
YOSHIOKA SHINGO
JP42 patents
⚠️ This page may combine multiple inventors who share the name “YOSHIOKA SHINGO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PANASONIC CORP
12 patentsUS9351402B2May 24, 2016
Circuit board, and semiconductor device having component mounted on circuit board
PANASONIC CORP4 citations72
US9070393B2Jun 30, 2015
Three-dimensional structure in which wiring is provided on its surface
PANASONIC CORP6 citations72
US8759148B2Jun 24, 2014
Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
PANASONIC CORP1 citations63
US9082438B2Jul 14, 2015
Three-dimensional structure for wiring formation
PANASONIC CORP2 citations62
US9795033B2Oct 17, 2017
Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
PANASONIC CORP0 citations52
US9736935B2Aug 15, 2017
Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board
PANASONIC CORP0 citations52
US8901728B2Dec 2, 2014
Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
PANASONIC CORP0 citations52
US9332642B2May 3, 2016
Circuit board
PANASONIC CORP0 citations51
US9082825B2Jul 14, 2015
Manufacturing method for semiconductor package, semiconductor package, and semiconductor device
PANASONIC CORP1 citations51
US9204530B2Dec 1, 2015
Electronic components assembly
PANASONIC CORP0 citations50
US9175151B2Nov 3, 2015
Resin composition and method for producing circuit board
PANASONIC CORP0 citations50
US9669567B2Jun 6, 2017
Manufacturing method of molded article
PANASONIC CORP0 citations40
PANASONIC IP MAN CO LTD
11 patentsUS9468092B2Oct 11, 2016
Electrically conductive film
PANASONIC IP MAN CO LTD14 citations92
US10009994B2Jun 26, 2018
Resin composition and film using same
PANASONIC IP MAN CO LTD5 citations83
US10966317B2Mar 30, 2021
Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure
PANASONIC IP MAN CO LTD5 citations72
US10371612B2Aug 6, 2019
Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board material
PANASONIC IP MAN CO LTD2 citations72
US9802397B2Oct 31, 2017
Structural member for electronic devices
PANASONIC IP MAN CO LTD6 citations72
US9585248B2Feb 28, 2017
Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board
PANASONIC IP MAN CO LTD0 citations52
US10791624B2Sep 29, 2020
Resin composition and film using same
PANASONIC IP MAN CO LTD0 citations51
US10299379B2May 21, 2019
Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure
PANASONIC IP MAN CO LTD0 citations51
US10109390B2Oct 23, 2018
Conductive film, and touch panel, display, touch sensor, and solar cell using the same
PANASONIC IP MAN CO LTD0 citations51
US9839119B2Dec 5, 2017
Electrically conductive film
PANASONIC IP MAN CO LTD0 citations51
US9568673B2Feb 14, 2017
Dry film for optical waveguides, optical waveguide using same, photoelectric composite wiring board using same, and method for producing photoelectric composite wiring board
PANASONIC IP MAN CO LTD0 citations50
YOSHIOKA SHINGO
7 patentsUS8482137B2Jul 9, 2013
Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
YOSHIOKA SHINGO22 citations92
US8240036B2Aug 14, 2012
Method of producing a circuit board
YOSHIOKA SHINGO19 citations92
US9332650B2May 3, 2016
Method of producing multilayer circuit board
YOSHIOKA SHINGO7 citations83
US8929092B2Jan 6, 2015
Circuit board, and semiconductor device having component mounted on circuit board
YOSHIOKA SHINGO10 citations83
US8698003B2Apr 15, 2014
Method of producing circuit board, and circuit board obtained using the manufacturing method
YOSHIOKA SHINGO4 citations72
US8272126B2Sep 25, 2012
Method of producing circuit board
YOSHIOKA SHINGO6 citations72
US9082635B2Jul 14, 2015
Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board
YOSHIOKA SHINGO1 citations50
SONY CORP
4 patentsUS8032011B2Oct 4, 2011
Recording medium having recording program recorded therein and recording apparatus and method
SONY CORP2 citations63
US7161878B2Jan 9, 2007
Recording apparatus for an optical disk
SONY CORP4 citations63
US7057984B2Jun 6, 2006
Recorder apparatus, method, and processing program for recording data from a position continuously succeeding a recorded area
SONY CORP3 citations63
US7469094B2Dec 23, 2008
Medium recording method, medium recording device, and information recording medium
SONY CORP0 citations42
PIONEER CORP
3 patentsUS7233736B2Jun 19, 2007
Recording method and apparatus, and recording medium
PIONEER CORP5 citations63
US7043620B2May 9, 2006
Recording medium having recording program recorded therein and recording apparatus and method
PIONEER CORP5 citations63
US7035969B2Apr 25, 2006
Recording medium having recording program recorded therein
PIONEER CORP6 citations63