Inventor

FUJIWARA HIROAKI

JP59 patents

⚠️ This page may combine multiple inventors who share the name “FUJIWARA HIROAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJIWARA HIROAKI

PANASONIC IP MAN CO LTD

Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit board

Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board

Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board

Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board

Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate

Metal-clad laminate, printed wiring board and metal foil with resin

Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring board

Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board

Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used

Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used

Prepreg, and metal-clad laminated board and wiring substrate obtained using same

Prepreg, metal-clad laminate, and wiring board

Metal-clad laminate, metal foil with resin, and wiring board

Prepreg, metal-clad laminate, and wiring board

PANASONIC CORP

Circuit board, and semiconductor device having component mounted on circuit board

Three-dimensional structure in which wiring is provided on its surface

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Three-dimensional structure for wiring formation

Mounting process simulation system and method thereof

Method for analyzing component mounting board

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Circuit board

Manufacturing method for semiconductor package, semiconductor package, and semiconductor device

Electronic components assembly

Resin composition and method for producing circuit board

YOSHIOKA SHINGO

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Method of producing a circuit board

Method of producing multilayer circuit board

Circuit board, and semiconductor device having component mounted on circuit board

Method of producing circuit board, and circuit board obtained using the manufacturing method

Method of producing circuit board

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Component-mounted circuit board production system

Portable terminal and message notifying system using the same

Method and apparatus of checking mount quality of circuit board

Apparatus and method for setting teaching data, teaching data providing system over network

KAWASAKI HEAVY IND LTD

Valve device

Relief valve

Solenoid flow control valve

Swing-back preventing apparatus

ITAI DAISUKE

Information processing system, information processing method, and computer-readable storage medium

Information processing system, information processing method, and memory medium

MITSUI KINZOKU ACT CORP

Vehicle door latch apparatus

Vehicle door latch apparatus

MATSUSHITA ELECTRIC WORKS LTD

Poly (phenylene ether) resin composition, prepreg, and laminated sheet

HABASIT AG

Curved belt support apparatus

PANASONIC ELEC WORKS CO LTD

Poly (phenylene ether) resin composition, prepreg, and laminated sheet

SUMITOMO DAINIPPON PHARMA CO LTD

Substituted purine derivative

CANON KK

Information processing apparatus, information processing method, article manufacturing system, and article manufacturing method

FUKUHARA YASUO

Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board