Inventor
SHIN SANG HYUN
KR47 patents
⚠️ This page may combine multiple inventors who share the name “SHIN SANG HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHIN SANG HYUN
14 patentsUS8136052B2Mar 13, 2012
Touch screen device and operating method thereof
SHIN SANG HYUN100 citations96
US8471481B2Jun 25, 2013
Lighting apparatus using PN junction light-emitting element and dimming method thereof
SHIN SANG HYUN10 citations83
US8312391B2Nov 13, 2012
Touch screen device and operating method thereof
SHIN SANG HYUN8 citations83
US8302032B2Oct 30, 2012
Touch screen device and operating method thereof
SHIN SANG HYUN12 citations83
USD667968SSep 25, 2012
LED illumination unit
SHIN SANG HYUN16 citations81
US9552572B2Jan 24, 2017
Mobile terminal
SHIN SANG HYUN3 citations73
US8492981B2Jul 23, 2013
Lighting apparatus using PN junction light-emitting element
SHIN SANG HYUN6 citations72
US8586128B2Nov 19, 2013
Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
SHIN SANG HYUN4 citations63
US11625456B2Apr 11, 2023
Group-based community system and method for managing the same
SHIN SANG HYUN0 citations62
US11282102B2Mar 22, 2022
Method for providing rewards based on consumption of contents and apparatus thereof
SHIN SANG HYUN1 citations62
US8556466B2Oct 15, 2013
Lighting apparatus using light-emitting diode
SHIN SANG HYUN4 citations61
US11425135B2Aug 23, 2022
Method for platform user management using badge system
SHIN SANG HYUN0 citations52
US8610146B2Dec 17, 2013
Light emitting diode package and method of manufacturing the same
SHIN SANG HYUN0 citations52
US8476090B2Jul 2, 2013
Method forming a semiconductor light emitting device with perforations formed within
SHIN SANG HYUN0 citations52
SAMSUNG ELECTRO MECH
7 patentsUS7566912B2Jul 28, 2009
Light emitting diode package
SAMSUNG ELECTRO MECH21 citations93
US7547923B2Jun 16, 2009
Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
SAMSUNG ELECTRO MECH33 citations92
US7268014B2Sep 11, 2007
Fabrication method of light emitting diode package
SAMSUNG ELECTRO MECH49 citations92
US8368291B2Feb 5, 2013
Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate
SAMSUNG ELECTRO MECH3 citations60
US7998879B2Aug 16, 2011
Insulation structure for high temperature conditions and manufacturing method thereof
SAMSUNG ELECTRO MECH1 citations52
US7863640B2Jan 4, 2011
Light emitting diode package, circuit board for light emitting diode package and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations52
US9288902B2Mar 15, 2016
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations51
LG ELECTRONICS INC
4 patentsUS8028251B2Sep 27, 2011
Touch screen device and method of selecting files thereon
LG ELECTRONICS INC26 citations92
US7916125B2Mar 29, 2011
Touch screen device and method of displaying images thereon
LG ELECTRONICS INC20 citations91
US7782308B2Aug 24, 2010
Touch screen device and method of method of displaying images thereon
LG ELECTRONICS INC19 citations91
US7737958B2Jun 15, 2010
Touch screen device and method of displaying and selecting menus thereof
LG ELECTRONICS INC30 citations90
SAMSUNG ELECTRONICS CO LTD
4 patentsUS7626957B2Dec 1, 2009
Home agent management apparatus and method
SAMSUNG ELECTRONICS CO LTD30 citations92
US7301957B2Nov 27, 2007
Multi-home agent control apparatus and method
SAMSUNG ELECTRONICS CO LTD9 citations73
US7436860B2Oct 14, 2008
Method of advertising DNS server address and routing method thereby
SAMSUNG ELECTRONICS CO LTD4 citations62
US9257615B2Feb 9, 2016
Light emitting device package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
LEE YOUNG KI
4 patentsUS8299692B2Oct 30, 2012
Light emitting device package and method of manufacturing the same
LEE YOUNG KI5 citations73
US8058781B2Nov 15, 2011
Anodized metal substrate module
LEE YOUNG KI4 citations63
US9231167B2Jan 5, 2016
Insulation structure for high temperature conditions and manufacturing method thereof
LEE YOUNG KI0 citations52
US8304279B2Nov 6, 2012
Light emitting diode package having anodized insulation layer and fabrication method therefor
LEE YOUNG KI0 citations52
SAMSUNG LED CO LTD
3 patentsUS8030762B2Oct 4, 2011
Light emitting diode package having anodized insulation layer and fabrication method therefor
SAMSUNG LED CO LTD8 citations84
US8047693B2Nov 1, 2011
Cooling device for light emitting device package of vibration generating machine and head lamp for vibration generating machine
SAMSUNG LED CO LTD0 citations52
US7960806B2Jun 14, 2011
Sub-mount, light emitting diode package and manufacturing method thereof
SAMSUNG LED CO LTD1 citations52