Inventor

KO YOUNG KI

KR4 patents

⚠️ This page may combine multiple inventors who share the name “KO YOUNG KI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YOO SE HOON

1 patent

US8486827B2Jul 16, 2013

Device of filling metal in through-via-hole of semiconductor wafer and method using the same

YOO SE HOON3 citations52

SAMSUNG ELECTRONICS CO LTD

1 patent

US10545303B2Jan 28, 2020

Optical cable and optical cable assembly having the same

SAMSUNG ELECTRONICS CO LTD0 citations43

YOO SEHOON

1 patent

US9603254B2Mar 21, 2017

Apparatus for filling a wafer via with solder

YOO SEHOON0 citations42

KOREA INST IND TECH

1 patent

US10115635B2Oct 30, 2018

Method for filling a wafer via with solder

KOREA INST IND TECH0 citations38