Inventor

JUN BYUNG-SEOK

KR2 patents

Patents

2 patents

US7262080B2Aug 28, 2007

BGA package with stacked semiconductor chips and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD58 citations91

US7528475B2May 5, 2009

BGA package with stacked semiconductor chips and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD8 citations79