Inventor
YOON SUNG HWAN
KR32 patents
⚠️ This page may combine multiple inventors who share the name “YOON SUNG HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LG DISPLAY CO LTD
11 patentsUS10667411B2May 26, 2020
Multi-panel display device
LG DISPLAY CO LTD6 citations73
US9332665B2May 3, 2016
Display apparatus
LG DISPLAY CO LTD5 citations70
US12266472B2Apr 1, 2025
Mounting jig for manufacturing tiling display device, and tiling display device and manufacturing method therefor
LG DISPLAY CO LTD0 citations62
US12237107B2Feb 25, 2025
Mounting jig for manufacturing tiling display device, and tiling display device and manufacturing method therefor
LG DISPLAY CO LTD0 citations62
US7708515B2May 4, 2010
Apparatus for loading substrate of liquid crystal display
LG DISPLAY CO LTD2 citations62
US12289844B2Apr 29, 2025
Display device
LG DISPLAY CO LTD0 citations53
US12279384B2Apr 15, 2025
Display device
LG DISPLAY CO LTD0 citations53
US12094372B2Sep 17, 2024
Display device
LG DISPLAY CO LTD0 citations53
US7494833B2Feb 24, 2009
Apparatus for stacking cassette and a method of fabricating a liquid crystal display device using the same
LG DISPLAY CO LTD1 citations52
US10156745B2Dec 18, 2018
Liquid crystal display having fixing unit for optical sheet
LG DISPLAY CO LTD0 citations50
US9753315B2Sep 5, 2017
Liquid crystal display device having fixing unit for optical sheet
LG DISPLAY CO LTD1 citations50
SAMSUNG ELECTRONICS CO LTD
8 patentsUS7282431B2Oct 16, 2007
Single chip and stack-type chip semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD25 citations92
US7615859B2Nov 10, 2009
Thin semiconductor package having stackable lead frame and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US7176558B2Feb 13, 2007
Single chip and stack-type chip semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US7364784B2Apr 29, 2008
Thin semiconductor package having stackable lead frame and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations74
US8022517B2Sep 20, 2011
Semiconductor chip package
SAMSUNG ELECTRONICS CO LTD0 citations52
US7847396B2Dec 7, 2010
Semiconductor chip stack-type package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7414303B2Aug 19, 2008
Lead on chip semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US7863715B2Jan 4, 2011
Stack package and stack packaging method
SAMSUNG ELECTRONICS CO LTD0 citations48
YOUL CHON CHEMICAL CO LTD
2 patentsHYUN DAI HEAVY IND CO LTD
2 patentsBOE TECHNOLOGY GROUP CO LTD
2 patentsUS9926137B2Mar 27, 2018
Fork assembly for storage/retrieval machine and storage/retrieval machine, method for conveying cartridges
BOE TECHNOLOGY GROUP CO LTD0 citations41
US10317889B2Jun 11, 2019
Work-in-process management control method, work-in-process management control system, and non-transitory computer readable storage medium
BOE TECHNOLOGY GROUP CO LTD0 citations40