Inventor

RATHBURN JAMES

US44 patents

⚠️ This page may combine multiple inventors who share the name “RATHBURN JAMES”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RATHBURN JAMES

RATHBURN JAMES

Compliant wafer level probe assembly

Selective metalization of electrical connector or socket housing

Compliant printed circuit semiconductor package

Compliant core peripheral lead semiconductor test socket

Compliant conductive nano-particle electrical interconnect

Singulated semiconductor device separable electrical interconnect

Copper pillar full metal via electrical circuit structure

Bumped semiconductor wafer or die level electrical interconnect

Simulated wirebond semiconductor package

Compliant printed circuit semiconductor tester interface

Semiconductor die terminal

High performance surface mount electrical interconnect

Method of making a compliant printed circuit peripheral lead semiconductor package

Compliant printed circuit socket diagnostic tool

Compliant printed circuit wafer probe diagnostic tool

Method of making a compliant printed circuit peripheral lead semiconductor test socket

Electrical interconnect IC device socket

Method of forming a semiconductor socket

Electrical interconnect IC device socket

Composite polymer-metal electrical contacts

Metalized pad to electrical contact interface

High performance electrical circuit structure

Resilient conductive electrical interconnect

High performance surface mount electrical interconnect with external biased normal force loading

Semiconductor device package adapter

Electrical connector insulator housing

Compliant printed circuit wafer level semiconductor package

High performance surface mount electrical interconnect

Compliant printed circuit area array semiconductor device package

Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection

Direct metalization of electrical circuit structures

Compliant printed flexible circuit

Stud bumped printed circuit assembly

HSIO TECH LLC

Performance enhanced semiconductor socket

Fusion bonded liquid crystal polymer circuit structure

Hybrid printed circuit assembly with low density main core and embedded high density circuit regions

High performance surface mount electrical interconnect

Semiconductor socket with direct selective metalization

HSIO TECHNOLOGIES LLC

Compliant core peripheral lead semiconductor socket

Compliant printed circuit semiconductor package

Compliant conductive nano-particle electrical interconnect

High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly

LCP MEDICAL TECH LLC

Liquid crystal polymer embedded microelectronics device

Liquid crystal polymer embedded microelectronics device