Inventor
JAU JACK
US47 patents
⚠️ This page may combine multiple inventors who share the name “JAU JACK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HERMES MICROVISION INC
22 patentsUS8748814B1Jun 10, 2014
Structure for inspecting defects in word line array fabricated by SADP process and method thereof
HERMES MICROVISION INC63 citations98
US7105436B2Sep 12, 2006
Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing
HERMES MICROVISION INC84 citations97
US10236156B2Mar 19, 2019
Apparatus of plural charged-particle beams
HERMES MICROVISION INC13 citations84
US10102619B1Oct 16, 2018
Inspection method and system
HERMES MICROVISION INC4 citations84
US9541824B1Jan 10, 2017
Method and system for fast inspecting defects
HERMES MICROVISION INC7 citations84
US9282293B2Mar 8, 2016
Method and system for measuring critical dimension and monitoring fabrication uniformity
HERMES MICROVISION INC4 citations84
US7919760B2Apr 5, 2011
Operation stage for wafer edge inspection and review
HERMES MICROVISION INC15 citations83
US10380731B1Aug 13, 2019
Method and system for fast inspecting defects
HERMES MICROVISION INC2 citations73
US10020164B2Jul 10, 2018
Charged particle beam apparatus
HERMES MICROVISION INC2 citations73
US9953803B2Apr 24, 2018
Local alignment point calibration method in die inspection
HERMES MICROVISION INC3 citations73
US9400176B2Jul 26, 2016
Dynamic focus adjustment with optical height detection apparatus in electron beam system
HERMES MICROVISION INC4 citations73
US9190241B2Nov 17, 2015
Charged particle beam apparatus
HERMES MICROVISION INC1 citations63
US9100553B2Aug 4, 2015
Method and system for measuring critical dimension and monitoring fabrication uniformity
HERMES MICROVISION INC3 citations63
US9041795B2May 26, 2015
Method and system for measuring critical dimension and monitoring fabrication uniformity
HERMES MICROVISION INC3 citations63
US8055059B2Nov 8, 2011
Method and system for determining a defect during sample inspection involving charged particle beam imaging
HERMES MICROVISION INC2 citations63
US8050490B2Nov 1, 2011
Method for inspecting overlay shift defect during semiconductor manufacturing and apparatus thereof
HERMES MICROVISION INC4 citations63
US7973283B2Jul 5, 2011
Method for regulating scanning sample surface charge in continuous and leap-and-scan scanning mode imaging process
HERMES MICROVISION INC3 citations63
US7884334B2Feb 8, 2011
Charged particle beam imaging method and system thereof
HERMES MICROVISION INC3 citations63
US9965844B1May 8, 2018
Inspection method and system
HERMES MICROVISION INC1 citations62
US7474001B2Jan 6, 2009
Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing
HERMES MICROVISION INC4 citations62
US9362087B2Jun 7, 2016
Charged particle beam apparatus
HERMES MICROVISION INC0 citations52
US9177758B2Nov 3, 2015
Charged particle beam apparatus
HERMES MICROVISION INC1 citations52
ASML NETHERLANDS BV
8 patentsUS10497538B2Dec 3, 2019
Local alignment point calibration method in die inspection
ASML NETHERLANDS BV1 citations73
US11217423B2Jan 4, 2022
Apparatus of plural charged-particle beams
ASML NETHERLANDS BV1 citations63
US11880971B2Jan 23, 2024
Inspection method and system
ASML NETHERLANDS BV0 citations62
US11430631B2Aug 30, 2022
Methods of inspecting samples with multiple beams of charged particles
ASML NETHERLANDS BV0 citations62
US11250559B2Feb 15, 2022
Inspection method and system
ASML NETHERLANDS BV0 citations62
US11043356B2Jun 22, 2021
Local alignment point calibration method in die inspection
ASML NETHERLANDS BV0 citations62
US10679340B2Jun 9, 2020
Inspection method and system
ASML NETHERLANDS BV0 citations52
US10586681B2Mar 10, 2020
Charged particle beam apparatus
ASML NETHERLANDS BV0 citations52
FANG WEI
6 patentsUS8884224B2Nov 11, 2014
Charged particle beam imaging assembly and imaging method thereof
FANG WEI9 citations84
US8606017B1Dec 10, 2013
Method for inspecting localized image and system thereof
FANG WEI7 citations83
US9494856B1Nov 15, 2016
Method and system for fast inspecting defects
FANG WEI2 citations63
US8432441B2Apr 30, 2013
Method and system for measuring critical dimension and monitoring fabrication uniformity
FANG WEI3 citations63
US8923601B2Dec 30, 2014
Method for inspecting overlay shift defect during semiconductor manufacturing and apparatus thereof
FANG WEI0 citations52
US8805054B2Aug 12, 2014
Method and system of classifying defects on a wafer
FANG WEI0 citations51
ZHAO YAN
4 patentsUS8294094B1Oct 23, 2012
Method and apparatus for reducing substrate edge effect during inspection
ZHAO YAN10 citations84
US8692214B2Apr 8, 2014
Charged particle beam inspection method
ZHAO YAN5 citations73
US8937281B2Jan 20, 2015
Method for examining a sample by using a charged particle beam
ZHAO YAN3 citations63
US8299431B2Oct 30, 2012
Method for examining a sample by using a charged particle beam
ZHAO YAN3 citations63