P

Inventor

JAU JACK

US47 patents
⚠️ This page may combine multiple inventors who share the name “JAU JACK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HERMES MICROVISION INC

22 patents
US8748814B1Jun 10, 2014

Structure for inspecting defects in word line array fabricated by SADP process and method thereof

HERMES MICROVISION INC63 citations98
US7105436B2Sep 12, 2006

Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing

HERMES MICROVISION INC84 citations97
US10236156B2Mar 19, 2019

Apparatus of plural charged-particle beams

HERMES MICROVISION INC13 citations84
US10102619B1Oct 16, 2018

Inspection method and system

HERMES MICROVISION INC4 citations84
US9541824B1Jan 10, 2017

Method and system for fast inspecting defects

HERMES MICROVISION INC7 citations84
US9282293B2Mar 8, 2016

Method and system for measuring critical dimension and monitoring fabrication uniformity

HERMES MICROVISION INC4 citations84
US7919760B2Apr 5, 2011

Operation stage for wafer edge inspection and review

HERMES MICROVISION INC15 citations83
US10380731B1Aug 13, 2019

Method and system for fast inspecting defects

HERMES MICROVISION INC2 citations73
US10020164B2Jul 10, 2018

Charged particle beam apparatus

HERMES MICROVISION INC2 citations73
US9953803B2Apr 24, 2018

Local alignment point calibration method in die inspection

HERMES MICROVISION INC3 citations73
US9400176B2Jul 26, 2016

Dynamic focus adjustment with optical height detection apparatus in electron beam system

HERMES MICROVISION INC4 citations73
US9190241B2Nov 17, 2015

Charged particle beam apparatus

HERMES MICROVISION INC1 citations63
US9100553B2Aug 4, 2015

Method and system for measuring critical dimension and monitoring fabrication uniformity

HERMES MICROVISION INC3 citations63
US9041795B2May 26, 2015

Method and system for measuring critical dimension and monitoring fabrication uniformity

HERMES MICROVISION INC3 citations63
US8055059B2Nov 8, 2011

Method and system for determining a defect during sample inspection involving charged particle beam imaging

HERMES MICROVISION INC2 citations63
US8050490B2Nov 1, 2011

Method for inspecting overlay shift defect during semiconductor manufacturing and apparatus thereof

HERMES MICROVISION INC4 citations63
US7973283B2Jul 5, 2011

Method for regulating scanning sample surface charge in continuous and leap-and-scan scanning mode imaging process

HERMES MICROVISION INC3 citations63
US7884334B2Feb 8, 2011

Charged particle beam imaging method and system thereof

HERMES MICROVISION INC3 citations63
US9965844B1May 8, 2018

Inspection method and system

HERMES MICROVISION INC1 citations62
US7474001B2Jan 6, 2009

Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing

HERMES MICROVISION INC4 citations62
US9362087B2Jun 7, 2016

Charged particle beam apparatus

HERMES MICROVISION INC0 citations52
US9177758B2Nov 3, 2015

Charged particle beam apparatus

HERMES MICROVISION INC1 citations52

ASML NETHERLANDS BV

8 patents

FANG WEI

6 patents

ZHAO YAN

4 patents

XIAO HONG

1 patent

HERMES MICROVISION TAIWAN INC

1 patent

Zhang zhao-li

1 patent

LIAO CHAD

1 patent

JAU JACK

1 patent

HERMES-MICROVISION INC

1 patent

WANG JOE

1 patent