Inventor

MCSHANE MICHAEL B

US56 patents

⚠️ This page may combine multiple inventors who share the name “MCSHANE MICHAEL B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MCSHANE MICHAEL B

MOTOROLA INC

Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding

Thermally enhanced semiconductor device having exposed backside and method for making the same

Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film

Stacking three dimensional leadless multi-chip module and method for making the same

Overmolded semiconductor device having solder ball and edge lead connective structure

Semiconductor device having a pad array carrier package

Semiconductor device having dual electrical contact sites

Molded electronic package with compression structures

High performance overmolded electronic package

Low cost integrated circuit bonding process

Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same

Lead-on-chip semiconductor device and method for making the same

Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation

Method of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereon

Plastic pad array electronic AC device

Thin, molded, surface mount electronic device

Packaged semiconductor device having a low cost ceramic PGA package

Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film

Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation

Method for making a lead-on-chip semiconductor device having peripheral bond pads

Lead-on chip semiconductor device having peripheral bond pads

Semiconductor device having a multilayer leadframe with full power and ground planes

Process of making an electronic device package with peripheral carrier structure of low-cost plastic

Semiconductor device having thin package body and method for making the same

Method for fabricating semiconductor device including package

TAB tape translator for use with semiconductor devices

Flagless semiconductor package

Electronic device package with peripheral carrier structure of low-cost plastic

Method for encapsulating semiconductor devices with package bodies

Flagless semiconductor device

FREESCALE SEMICONDUCTOR INC

High bandwidth cache-to-processing unit communication in a multiple processor/cache system

Die stack with optical TSVs

Optical backplane mirror

Integration of a MEMS beam with optical waveguide and deflection in two dimensions

Optical wafer and die probe testing

Communication system die stack

Defective die replacement in a die stack

Optical redundancy

Microelectronic assembly having a heat spreader for a plurality of die

Gate security feature

Die stack address bus having a programmable width

Thin low profile strip dual in-line memory module

PELLEY PERRY H

Stacked semiconductor die with continuous conductive vias

Stacked semiconductor devices

Semiconductor devices with nonconductive vias

MCSHANE MICHAEL B

Techniques for reducing inductance in through-die vias of an electronic assembly

Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices

FREESCALE SMEICONDUCTOR INC

Edge mounted integrated circuits with heat sink

HESS KEVIN J

Semiconductor device package

PHAM TIM V

Wirebond recess for stacked die