Inventor
LEE KYU WON
KR30 patents
⚠️ This page may combine multiple inventors who share the name “LEE KYU WON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LG ELECTRONICS INC
5 patentsUS6548767B1Apr 15, 2003
Multi-layer printed circuit board having via holes formed from both sides thereof
LG ELECTRONICS INC69 citations95
US7930909B2Apr 26, 2011
Steam generator and washing/drying machine having the same
LG ELECTRONICS INC1 citations52
US7954344B2Jun 7, 2011
Steam generator and washing machine therewith
LG ELECTRONICS INC1 citations51
US8375495B2Feb 19, 2013
Control method of laundry machine
LG ELECTRONICS INC1 citations50
US7950257B2May 31, 2011
Steam generator and washing machine therewith
LG ELECTRONICS INC0 citations40
SK HYNIX INC
4 patentsUS9515052B1Dec 6, 2016
Semiconductor package including a step type substrate
SK HYNIX INC9 citations78
US9093441B2Jul 28, 2015
Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same
SK HYNIX INC6 citations71
US9305912B2Apr 5, 2016
Stack package and method for manufacturing the same
SK HYNIX INC0 citations50
US8951810B2Feb 10, 2015
Methods for forming interconnection line using screen printing technique
SK HYNIX INC0 citations50
AMKOR TECHNOLOGY INC
3 patentsUS7902660B1Mar 8, 2011
Substrate for semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC188 citations98
US7317245B1Jan 8, 2008
Method for manufacturing a semiconductor device substrate
AMKOR TECHNOLOGY INC73 citations95
US6853060B1Feb 8, 2005
Semiconductor package using a printed circuit board and a method of manufacturing the same
AMKOR TECHNOLOGY INC43 citations89
LEE KYU WON
3 patentsUS8564141B2Oct 22, 2013
Chip unit and stack package having the same
LEE KYU WON32 citations89
US8461696B2Jun 11, 2013
Substrate for semiconductor package, semiconductor package including the same, and stack package using the semiconductor package
LEE KYU WON0 citations50
US8476751B2Jul 2, 2013
Stacked semiconductor package and method for manufacturing the same
LEE KYU WON0 citations38
LG INNOTEK CO LTD
3 patentsUS9781835B2Oct 3, 2017
Printed circuit board
LG INNOTEK CO LTD9 citations82
US9661759B2May 23, 2017
Printed circuit board and method of manufacturing the same
LG INNOTEK CO LTD2 citations71
US9888569B2Feb 6, 2018
Printed circuit board having buried circuit pattern and method for manufacturing the same
LG INNOTEK CO LTD0 citations40