Inventor

SIM Tangyii

JP2 patents

Patents

2 patents

US11259409B2Feb 22, 2022

Conductor substrate, wiring substrate and method for producing wiring substrate

HITACHI CHEMICAL CO LTD0 citations56

US10880997B2Dec 29, 2020

Stretchable member with metal foil

HITACHI CHEMICAL CO LTD0 citations45