Inventor
FORTIER PAUL FRANCIS
CA18 patents
⚠️ This page may combine multiple inventors who share the name “FORTIER PAUL FRANCIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS6508595B1Jan 21, 2003
Assembly of opto-electronic module with improved heat sink
IBM58 citations94
US9720188B2Aug 1, 2017
Connecting mid-board optical modules
IBM15 citations91
US6822875B2Nov 23, 2004
Assembly of opto-electronic module with improved heat sink
IBM27 citations90
US11209598B2Dec 28, 2021
Photonics package with face-to-face bonding
IBM11 citations82
US10295749B1May 21, 2019
Optical interconnect attach to photonic device with partitioning adhesive function
IBM13 citations82
US9835804B2Dec 5, 2017
Connecting mid-board optical modules
IBM7 citations82
US9706670B1Jul 11, 2017
Connecting mid-board electronic devices
IBM7 citations82
US10128590B2Nov 13, 2018
Pluggable LGA socket for high density interconnects
IBM2 citations73
US9577361B2Feb 21, 2017
Pluggable LGA socket for high density interconnects
IBM2 citations73
US10338325B1Jul 2, 2019
Nanofiller in an optical interface
IBM2 citations71
US9093563B2Jul 28, 2015
Electronic module assembly with patterned adhesive array
IBM4 citations71
US10754070B2Aug 25, 2020
Microlens array assembling process
IBM6 citations70
US11146003B2Oct 12, 2021
Pluggable LGA socket for high density interconnects
IBM0 citations62
US10690867B1Jun 23, 2020
Optical device with adhesive connection of recess or side protrusion
IBM1 citations62
US10073223B2Sep 11, 2018
Connecting mid-board optical modules
IBM1 citations61
US11280968B2Mar 22, 2022
High-bandwidth embedded optical connector with latching mechanism
IBM1 citations60
US10302869B1May 28, 2019
Optical interconnect attach to photonic device with partitioning adhesive function
IBM0 citations50