Inventor
BOUCHER EDMUND B
US3 patents
Patents
3 patentsUS6813154B2Nov 2, 2004
Reversible heat sink packaging assembly for an integrated circuit
MOTOROLA INC124 citations95
US6208526B1Mar 27, 2001
Mounting multiple substrate frame and leadless surface mountable assembly using same
MOTOROLA INC25 citations88
US6784366B1Aug 31, 2004
Thermal dissipation package for an electrical surface mount component
MOTOROLA INC18 citations77