Inventor

CHOU PAO HUNG

TW31 patents

⚠️ This page may combine multiple inventors who share the name “CHOU PAO HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOU PAO HUNG

PHOENIX PIONEER TECHNOLOGY CO LTD

Manufacturing method of package substrate with metal on conductive portions

Package on package and a method of fabricating the same

Flip-chip packaging substrate and method for fabricating the same

Antenna module, antenna supporting substrate and manufacturing method thereof

Inductance traces protected through shielding layers

Semiconductor package carrier board, method for fabricating the same, and electronic package having the same

Semiconductor package substrate, electronic package and methods for fabricating the same

Flip-chip package substrate and method for fabricating the same

Substrate structure and method of manufacturing the same

Method of fabricating a flip-chip package core substrate with build-up layers

Intermediate substrate and fabrication method thereof

Interposer substrate and method of fabricating the same

Interposer substrate and method of fabricating the same

Package substrate with metal on conductive portions and manufacturing method thereof

Interposer substrate and method of fabricating the same

Semiconductor packaging substrate, fabrication method and packaging process thereof

Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same

Flip-chip package substrate and method for preparing the same

Interposer substrate and method for fabricating the same

Package substrate

Method of fabricating package substrates

Substrate structure

Package substrate and its fabrication method

CHOU PAO-HUNG

Package structure having a semiconductor component embedded therein and method of fabricating the same

Package substrate and fabrication method thereof

Circuit board structure for electrical testing and fabrication method thereof

UNIMICRON TECHNOLOGY CORP

Method of fabricating package structure

Heat-conductive package structure

PHOENIX PREC TECHNOLOGY CORP

Method for fabricating a metal protection layer on electrically connecting pad of circuit board

Metal electroplating process of an electrically connecting pad structure of circuit board and structure thereof

ADVANCED SEMICONDUCTOR ENG

Package substrate and method for manufacturing the same