Inventor
SUDIJONO JOHN LEONARD
SG22 patents
⚠️ This page may combine multiple inventors who share the name “SUDIJONO JOHN LEONARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
19 patentsUS6683002B1Jan 27, 2004
Method to create a copper diffusion deterrent interface
CHARTERED SEMICONDUCTOR MFG71 citations98
US6720204B2Apr 13, 2004
Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding
CHARTERED SEMICONDUCTOR MFG38 citations92
US6500771B1Dec 31, 2002
Method of high-density plasma boron-containing silicate glass film deposition
CHARTERED SEMICONDUCTOR MFG24 citations92
US6475810B1Nov 5, 2002
Method of manufacturing embedded organic stop layer for dual damascene patterning
CHARTERED SEMICONDUCTOR MFG24 citations92
US6417088B1Jul 9, 2002
Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding
CHARTERED SEMICONDUCTOR MFG44 citations92
US6378759B1Apr 30, 2002
Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding
CHARTERED SEMICONDUCTOR MFG37 citations92
US6355581B1Mar 12, 2002
Gas-phase additives for an enhancement of lateral etch component during high density plasma film deposition to improve film gap-fill capability
CHARTERED SEMICONDUCTOR MFG52 citations90
US6540841B1Apr 1, 2003
Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate
CHARTERED SEMICONDUCTOR MFG13 citations84
US6705512B2Mar 16, 2004
Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding
CHARTERED SEMICONDUCTOR MFG10 citations74
US6415973B1Jul 9, 2002
Method of application of copper solution in flip-chip, COB, and micrometal bonding
CHARTERED SEMICONDUCTOR MFG9 citations74
US6309982B1Oct 30, 2001
Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agent
CHARTERED SEMICONDUCTOR MFG6 citations74
US6261955B1Jul 17, 2001
Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes
CHARTERED SEMICONDUCTOR MFG6 citations74
US6069082AMay 30, 2000
Method to prevent dishing in damascene CMP process
CHARTERED SEMICONDUCTOR MFG12 citations74
US6987321B2Jan 17, 2006
Copper diffusion deterrent interface
CHARTERED SEMICONDUCTOR MFG7 citations72
US6143598ANov 7, 2000
Method of fabrication of low leakage capacitor
CHARTERED SEMICONDUCTOR MFG15 citations70
US6813796B2Nov 9, 2004
Apparatus and methods to clean copper contamination on wafer edge
CHARTERED SEMICONDUCTOR MFG4 citations63
US6692579B2Feb 17, 2004
Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence
CHARTERED SEMICONDUCTOR MFG5 citations63
US6358821B1Mar 19, 2002
Method of copper transport prevention by a sputtered gettering layer on backside of wafer
CHARTERED SEMICONDUCTOR MFG5 citations63
US7678586B2Mar 16, 2010
Structure and method to prevent charge damage from e-beam curing process
CHARTERED SEMICONDUCTOR MFG0 citations52