Inventor
YASUMURA BUNJI
JP17 patents
⚠️ This page may combine multiple inventors who share the name “YASUMURA BUNJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
14 patentsUS9646901B2May 9, 2017
Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
RENESAS ELECTRONICS CORP3 citations84
US9053954B2Jun 9, 2015
Method for manufacturing semiconductor device
RENESAS ELECTRONICS CORP8 citations82
US10566255B2Feb 18, 2020
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP2 citations73
US9824944B2Nov 21, 2017
Semiconductor device
RENESAS ELECTRONICS CORP2 citations71
US9490218B2Nov 8, 2016
Method for manufacturing semiconductor device
RENESAS ELECTRONICS CORP3 citations71
US9911673B2Mar 6, 2018
Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
RENESAS ELECTRONICS CORP1 citations62
US8912540B2Dec 16, 2014
Semiconductor device
RENESAS ELECTRONICS CORP2 citations62
US9825017B2Nov 21, 2017
Method for manufacturing semiconductor device
RENESAS ELECTRONICS CORP1 citations61
US9230938B2Jan 5, 2016
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP2 citations61
US8945953B2Feb 3, 2015
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP2 citations61
US10134648B2Nov 20, 2018
Manufacturing method of semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US9165845B2Oct 20, 2015
Semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US10163740B2Dec 25, 2018
Semiconductor device
RENESAS ELECTRONICS CORP0 citations51
US10141295B2Nov 27, 2018
Method for manufacturing semiconductor device
RENESAS ELECTRONICS CORP0 citations51