Inventor

CHEN HOWARD E

US55 patents

⚠️ This page may combine multiple inventors who share the name “CHEN HOWARD E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN HOWARD E

SKYWORKS SOLUTIONS INC

Apparatus and methods related to ground paths implemented with surface mount devices

Power amplifier modules including related systems, devices, and methods

Shielded diversity receive module

Racetrack layout for radio frequency isolation structure

Via density in radio frequency shielding applications

Racetrack layout for radio frequency shielding

Intramodule radio frequency isolation

Radio frequency module including segmented conductive top layer

Racetrack design in radio frequency shielding applications

Systems and methods for providing intramodule radio frequency isolation

Segmented conductive top layer for radio frequency isolation

Via placement in radio frequency shielding applications

Apparatus and methods related to conformal coating implemented with surface mount devices

Systems and methods related to near-field electromagnetic scanners

Conformal shielding for a diversity receive module

Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same

Methods related to dual-sided module with land-grid array (LGA) footprint

Apparatus related to conformal coating implemented with surface mount devices

Methods of determining racetrack layout for radio frequency isolation structure

Semiconductor package having a metal paint layer

Radio frequency isolation structure

Apparatus and methods related to conformal coating implemented with surface mount devices

Dual-sided module with land-grid array (LGA) footprint

Radio frequency isolation structure with racetrack

Devices and methods related to fabrication of shielded modules

Semiconductor package having a metal paint layer

Semiconductor package having a metal paint layer

Devices and methods related to packaging of radio-frequency devices on ceramic substrates

Semiconductor package having a metal paint layer

Devices and methods related to dual-sided radio-frequency package with overmold structure

Devices related to dual-sided module with land-grid array (LGA) footprint

Devices for fabrication of shielded modules

Control of under-fill using a film during fabrication for a dual-sided ball grid array package

Dual-sided radio-frequency package with overmold structure

Methods and modules related to shielded lead frame packages

Devices and methods related to packaging of radio-frequency devices on ceramic substrates

Devices and methods related to metallization of ceramic substrates for shielding applications

Dual-sided radio-frequency package with overmold structure

Methods related to implementing surface mount devices with ground paths

Through-mold openings for dual-sided packaged modules with ball grid arrays

Methods and modules related to shielded lead frame packages

Shielded lead frame packages

Shielded radio-frequency module having reduced area

Electronic package and method for manufacturing an electronic package

Application of conductive via or trench for intra module EMI shielding

Methods related to dual-sided module with land-grid array (LGA) footprint

Methods for forming shielded radio-frequency modules having reduced area

CHEN HOWARD E

Via density and placement in radio frequency shielding applications

AGARWAL ANIL K

Radio-frequency modules having tuned shielding-wirebonds

KUHLMAN MARK A

3-D stacking of active devices over passive devices