Inventor

DARVEAUX ROBERT FRANCIS

US56 patents

⚠️ This page may combine multiple inventors who share the name “DARVEAUX ROBERT FRANCIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DARVEAUX ROBERT FRANCIS

SKYWORKS SOLUTIONS INC

Apparatus and methods related to conformal coating implemented with surface mount devices

Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same

Methods related to dual-sided module with land-grid array (LGA) footprint

Apparatus related to conformal coating implemented with surface mount devices

Apparatus and methods related to conformal coating implemented with surface mount devices

Dual-sided module with land-grid array (LGA) footprint

Control of under-fill using an encapsulant for a dual-sided ball grid array package

Control of under-fill using under-fill deflash for a dual-sided ball grid array package

Devices and methods related to dual-sided radio-frequency package with overmold structure

Devices related to dual-sided module with land-grid array (LGA) footprint

Control of under-fill using a film during fabrication for a dual-sided ball grid array package

Dual-sided radio-frequency package with overmold structure

Under-fill deflash for a dual-sided ball grid array package

Dual-sided radio-frequency package with overmold structure

Control of under-fill with a packaging substrate having an integrated trench for a dual-sided ball grid array package

Through-mold openings for dual-sided packaged modules with ball grid arrays

Reduction of packaging substrate deformation

Methods and devices related to reduced packaging substrate deformation

Method of manufacturing a radio-frequency module with a conformal shield antenna

Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array package

Methods related to dual-sided module with land-grid array (LGA) footprint

Low frequency shield solutions with sputtered/sprayed absorber materials and/or absorber materials mixed in mold compound

Packaged module with ball grid array and grounding pins for signal isolation, method of manufacturing the same, and wireless device comprising the same

Devices and methods related to nested filters

AMKOR TECHNOLOGY INC

Flip chip bump structure and fabrication method

Exposed die overmolded flip chip package and fabrication method

Fine pitch copper pillar package and method

Exposed die overmolded flip chip package and fabrication method

Fine pitch copper pillar package and method

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package

Fine pitch copper pillar package and method

Mechanical tape separation package

Stackable package and method

Flip chip bump structure and fabrication method

DARVEAUX ROBERT FRANCIS

Electronic component package fabrication method and structure

Fine pitch copper pillar package and method

Stackable package and method

Stackable treated via package and method

Flex circuit package and method

Exposed die overmolded flip chip package method

AMKOR TECH SINGAPORE HOLDING PTE LTD

Fine pitch copper pillar package and method

Stackable package and method

Packaging for fingerprint sensors and methods of manufacture

Fine pitch copper pillar package and method

ANAM SEMICONDUCTOR INC

Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same

Flexible circuit board for ball grid array semiconductor package

HUEMOELLER RONALD PATRICK

Flip chip bump structure and fabrication method

DUNLAP BRETT ARNOLD

Mechanical tape separation package and method