Inventor

KAO NAI-HAO

TW2 patents

⚠️ This page may combine multiple inventors who share the name “KAO NAI-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

1 patent

US6819565B2Nov 16, 2004

Cavity-down ball grid array semiconductor package with heat spreader

SILICONWARE PRECISION INDUSTRIES CO LTD15 citations80

TZENG YUAN-LIN

1 patent

US8207620B2Jun 26, 2012

Flip-chip semiconductor package and chip carrier for preventing corner delamination

TZENG YUAN-LIN1 citations42