Inventor
CHEN HSIAO-YUN
TW13 patents
⚠️ This page may combine multiple inventors who share the name “CHEN HSIAO-YUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
5 patentsUS9576929B1Feb 21, 2017
Multi-strike process for bonding
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US10068868B2Sep 4, 2018
Multi-strike process for bonding packages and the packages thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9978709B2May 22, 2018
Solder bump stretching method for forming a solder bump joint in a device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US9475145B2Oct 25, 2016
Solder bump joint in a device including lamellar structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US10229901B2Mar 12, 2019
Immersion interconnections for semiconductor devices and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41