Inventor
EGHAN ABU K
US3 patents
Patents
3 patentsUS7061102B2Jun 13, 2006
High performance flipchip package that incorporates heat removal with minimal thermal mismatch
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US7064450B1Jun 20, 2006
Semiconductor die with high density offset-inline bond arrangement
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US7701070B1Apr 20, 2010
Integrated circuit and method of implementing a contact pad in an integrated circuit
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